发明公开
EP1122782A3 Etched tri-layer metal with integrated wire traces for wire bonding
审中-公开
GeätztesDreilagenmetall mit integrierten Drahtbondleitungen
- 专利标题： Etched tri-layer metal with integrated wire traces for wire bonding
- 专利标题（中）： GeätztesDreilagenmetall mit integrierten Drahtbondleitungen
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申请号： EP00310260.5申请日： 2000-11-17
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公开(公告)号： EP1122782A3公开(公告)日： 2004-01-02
- 发明人: Goenka, Lakhi Nandlal , Paruchuri, Mohan R.
- 申请人： Visteon Global Technologies, Inc.
- 申请人地址： Suite 728, Parklane Towers East, One Parklane Boulevard Dearborn, Michigan 48126 US
- 专利权人： Visteon Global Technologies, Inc.
- 当前专利权人： Visteon Global Technologies, Inc.
- 当前专利权人地址： Suite 728, Parklane Towers East, One Parklane Boulevard Dearborn, Michigan 48126 US
- 代理机构： Gemmell, Peter Alan, Dr.
- 优先权： US495242 20000131
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/538
摘要：
A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
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