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公开(公告)号：EP1204304B1
公开(公告)日：2004-12-29
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K1/09 , H05K3/02 , B23K35/00 , B23K20/233
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
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2.发明公开Connector for connecting etched tri-metal circuits 有权Verbinder zum Verbinden vongeätztenTrimetallschaltungen
公开(公告)号：EP1204307A2
公开(公告)日：2002-05-08
申请号：EP01125896.9
申请日：2001-10-30
IPC分类号： H05K3/36
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： In conventional ETM circuit structures a pin connector in which the pin is etched from the ETM substrate and the mating cavity is etched from the ETM substrate to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin serves as an anchor with the metallurgical bonds with solder in the cavity that forms on the copper surfaces of the ETM circuit structure to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
摘要翻译： 在传统的ETM电路结构中，一个针式连接器，其中从ETM基板蚀刻引脚，并且从ETM基板蚀刻配合腔以进行配合。 连接器利用减法ETM结构处理来定义几个引脚腔配置中的任何一个。 该引脚用作锚固体，其中在空腔中与焊料的冶金结合形成在ETM电路结构的铜表面上，以为连接提供良好的机械强度。 特别地示出和描述了四种不同的互连配置。
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3.发明授权
公开(公告)号：EP1204303B1
公开(公告)日：2003-09-17
申请号：EP01125894.4
申请日：2001-10-30
发明人： Achari, Achyuta , Baker, Jay D. , Paruchuri, Mohan R. , Nation, Brenda Joyce , Goenka , Lakhi Nandlal , Stoica, Vladimir
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
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公开(公告)号：EP1204304A2
公开(公告)日：2002-05-08
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K3/02
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
摘要： A tri-metallic material for use in the manufacture of printed circuit boards is described. and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the "bread" of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.
摘要翻译： 描述了用于制造印刷电路板的三金属材料。 描述了其制造过程。 三金属材料是夹层，其中铜层是三明治的“面包”必不可少的，并且铝层是两片面包之间的填充物。 金属粘合和/或阻挡层散布在铝上，并且因其高度非腐蚀性以及其粘合和扩散抑制能力而被选择。
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5.发明公开Etched tri-layer metal with integrated wire traces for wire bonding 审中-公开GeätztesDreilagenmetall mit integrierten Drahtbondleitungen
公开(公告)号：EP1122782A3
公开(公告)日：2004-01-02
申请号：EP00310260.5
申请日：2000-11-17
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H01L24/45 , H01L21/4846 , H01L23/49861 , H01L23/5389 , H01L24/31 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4092 , H01L2924/013 , H01L2924/00013 , H01L2924/01033 , H01L2224/85399 , H01L2224/05599
摘要： A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
摘要翻译： 固定到印刷电路板的电路部件通常使用细线来完成从印刷电路到部件的电路。 该部件可以是其上具有一个或多个焊盘以用于接收导线的集成电路。 用于制造该器件的器件和方法具有形成在PCB上的印刷电路，其中一个或多个导线沿印刷电路蚀刻。 蚀刻剂除去蚀刻的三金属的底层的一部分和有时的中间层以及任何层压和粘合剂。 这形成了结合到部件上的线迹的自由端。 不需要额外的电线。
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公开(公告)号：EP1204304A3
公开(公告)日：2002-12-11
申请号：EP01125895.1
申请日：2001-10-30
IPC分类号： H05K1/09 , H05K3/02 , B23K35/00 , B23K20/233
CPC分类号： B32B15/018 , B32B15/017 , C23C2/26 , C23C2/28 , C23C26/00 , H05K3/022 , H05K2201/0361
摘要： A tri-metallic material (10) for use in the manufacture of printed circuit boards is described and the process for its manufacture is described. The tri-metallic material (10) is a sandwich wherein a copper layer (18,20) is essential the "bread" of the sandwich and an aluminum layer (12) is the filling between both slices of bread. A metallic bonding and/or barrier layer (30,32) is spread on the aluminum (12) and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.
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公开(公告)号：EP1204307A3
公开(公告)日：2002-10-30
申请号：EP01125896.9
申请日：2001-10-30
IPC分类号： H05K3/36
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
摘要： In conventional ETM (Etched Tri-Metal) circuit structures a pin connector in which the pin (30) is etched from the ETM substrate (16) and the mating cavity (32) is etched from the ETM substrate (18) to be mated. The connector utilizes the subtractive ETM structure processing to define any one of several pin-cavity configurations. The pin (30) serves as an anchor with the metallurgical bonds with solder (34) in the cavity (32) that forms on the copper surfaces (24,26) of the ETM circuit structures (16,18) to give good mechanical strength to the connection. In particular four different configurations of interconnections are shown and described.
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公开(公告)号：EP1122782A2
公开(公告)日：2001-08-08
申请号：EP00310260.5
申请日：2000-11-17
IPC分类号： H01L23/498 , H01L23/538
CPC分类号： H01L24/45 , H01L21/4846 , H01L23/49861 , H01L23/5389 , H01L24/31 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/484 , H01L2224/48699 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H05K3/4092 , H01L2924/013 , H01L2924/00013 , H01L2924/01033 , H01L2224/85399 , H01L2224/05599
摘要： A circuit component secured to a printed circuit board typically uses fine wires for completing the circuit from the printed circuit to the component. The component may be an integrated circuit having one or more pads thereon for receiving the wire. A device and method for making the device has the printed circuit formed on the PCB with one or more wire traces that are etched away from the printed circuit. The etchant removes a portion of the bottom layer and sometimes the middle layer of an etched tri-metal along with any lamination and adhesive. This forms a free end of the wire trace that is bonded to the component. Additional wires are not required.
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公开(公告)号：EP1204307B1
公开(公告)日：2003-08-27
申请号：EP01125896.9
申请日：2001-10-30
IPC分类号： H05K3/36
CPC分类号： H05K3/4007 , H05K3/062 , H05K3/363 , H05K2201/0361 , H05K2201/0367 , H05K2201/09745 , H05K2201/209 , H05K2203/0152 , H05K2203/0376 , H05K2203/1184 , Y10S439/943 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155
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10.发明公开
公开(公告)号：EP1204303A3
公开(公告)日：2002-12-11
申请号：EP01125894.4
申请日：2001-10-30
发明人： Achari, Achyuta , Baker, Jay D. , Paruchuri, Mohan R. , Nation, Brenda Joyce , Goenka , Lakhi Nandlal , Stoica, Vladimir
CPC分类号： H05K3/022 , B32B15/017 , B32B15/018 , H05K2201/0361 , Y10T29/49126
摘要： A method for forming sets (10,12,14) of tri-metal material involving the use of cladding mills (16,18,20,22). When multiple sets (10,12,14) of tri-metal material are formed, the outside surfaces of each set (10,12,14) is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer (32) on the outside surface of the tri-metal material. Alternatively bonding materials (36) may be used on the intermediate surfaces; such bonding materials (36) can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.
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