发明公开
- 专利标题： Method for heating a wafer
- 专利标题（中）： Verfahren zumErwärmenvonPlättchen
-
申请号： EP01124617.0申请日： 2001-10-15
-
公开(公告)号： EP1227171A1公开(公告)日： 2002-07-31
- 发明人: Rossman, Kent
- 申请人： Applied Materials, Inc.
- 申请人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构： Kirschner, Klaus Dieter, Dipl.-Phys.
- 优先权： US771085 20010126
- 主分类号： C23C16/02
- IPC分类号： C23C16/02 ; C23C14/02
摘要：
A method is provided for preparing a substrate for processing in a chamber that has a substrate receiving portion. The substrate is positioned within the chamber in a location not on the substrate receiving portion. A gaseous flow is provided to the chamber, from which a plasma is struck to heat the substrate. After the substrate has been heated, it is moved to the substrate receiving portion for processing.
公开/授权文献
- EP1227171B1 Method for heating a wafer 公开/授权日：2007-08-22
信息查询
IPC分类:
