发明公开
- 专利标题： PLASMA PROCESSING DEVICE
- 专利标题（中）： PLASMAVERARBEITUNGSEINRICHTUNG
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申请号： EP02707228申请日： 2002-03-28
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公开(公告)号： EP1300875A4公开(公告)日： 2006-12-20
- 发明人: OHMI TADAHIRO , HIRAYAMA MASAKI , SUGAWA SHIGETOSHI , GOTO T , HONGOH TOSHIAKI
- 申请人： OHMI TADAHIRO , TOKYO ELECTRON LTD
- 专利权人： OHMI TADAHIRO,TOKYO ELECTRON LTD
- 当前专利权人： OHMI TADAHIRO,TOKYO ELECTRON LTD
- 优先权： JP2001094274 2001-03-28
- 主分类号： H01J37/32
- IPC分类号： H01J37/32 ; H05H1/46 ; C23C16/50 ; C23C16/511 ; C23F4/00 ; C30B25/10 ; H01L21/302 ; H01L21/3065 ; H01L21/31
摘要：
A micro wave plasma processing device having a radial line slot antenna capable of suppressing an abnormal discharge to increase the exciting efficiency of micro wave plasma, wherein the tip part of a power supply line in a coaxial wave guide is separated from a slot plate forming a radiating surface at a connection part between the radial line slot antenna and the coaxial wave guide.
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