发明授权
EP1385683B1 DISPOSITIF DE COUPE DE COUCHE D'UN SUBSTRAT, ET PROCEDE ASSOCIE 有权
基材层切割装置和方法关联公司中,

DISPOSITIF DE COUPE DE COUCHE D'UN SUBSTRAT, ET PROCEDE ASSOCIE
摘要:
The invention relates to a device (40) for automatic high-precision cutting of a layer of material joined to a substrate source by means of an embrittled area, said source substrate and layer forming a set which is to be cut and said device comprising cutting means (531, 532) in addition to means (510) for maintaining the position of the set which is to be cut, characterized in that the cutting means comprise a blade which acts upon the set which is to be cut. The invention also relates to a method for using said device.
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