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公开(公告)号：EP2272084A2
公开(公告)日：2011-01-12
申请号：EP09742018.6
申请日：2009-04-30
IPC分类号： H01L21/18 , H01L27/146 , H01L25/065 , H01L21/98
CPC分类号： H01L21/76256 , C03C27/00 , H01L21/187 , H01L25/0657 , H01L25/50 , H01L27/146 , H01L27/1464 , H01L2924/0002 , H01L2924/00
摘要： The invention concerns a method of bonding two wafers (20, 30) by molecular bonding in which a first propagation of a bonding wave initiated from a point of pressure (43) applied to at least one (30) of the two wafers is followed by a second propagation of the bonding wave over a zone covering the point of pressure (43). The second bonding wave propagation may be obtained by interposing a separating element (41) between the two wafers and by withdrawing the element at least after the start of the first bonding wave propagation or by partially unbonding the surfaces of the assembled wafers over a zone located in the vicinity of the point of pressure (63).
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公开(公告)号：EP1385683B1
公开(公告)日：2005-08-31
申请号：EP02732797.2
申请日：2002-04-10
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
摘要： The invention relates to a device (40) for automatic high-precision cutting of a layer of material joined to a substrate source by means of an embrittled area, said source substrate and layer forming a set which is to be cut and said device comprising cutting means (531, 532) in addition to means (510) for maintaining the position of the set which is to be cut, characterized in that the cutting means comprise a blade which acts upon the set which is to be cut. The invention also relates to a method for using said device.
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公开(公告)号：EP1385683A1
公开(公告)日：2004-02-04
申请号：EP02732797.2
申请日：2002-04-10
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
摘要： The invention relates to a device (40) for automatic high-precision cutting of a layer of material joined to a substrate source by means of an embrittled area, said source substrate and layer forming a set which is to be cut and said device comprising cutting means (531, 532) in addition to means (510) for maintaining the position of the set which is to be cut, characterized in that the cutting means comprise a blade which acts upon the set which is to be cut. The invention also relates to a method for using said device.
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公开(公告)号：EP1208593B1
公开(公告)日：2011-02-16
申请号：EP00958697.5
申请日：2000-08-17
发明人： BARGE, Thierry , GHYSELEN, Bruno , IWAMATSU, Toshiaki , NARUOKA, Hideki , FURIHATA, Junichiro , MITANI, Kiyoshi
IPC分类号： H01L21/762 , H01L21/306
CPC分类号： H01L21/306 , H01L21/30625 , H01L21/76254 , Y10T428/12528
摘要： The invention relates to a method for treating substrates (1) for microelectronics or opto-electronics, comprising a useful layer (6) which is at least partially composed of an oxidable material on at least one of the surfaces thereof. The inventive method consists of a first sacrificial oxidation phase whereby a certain thickness of the material making up the useful layer (6) can be removed from the surface of each substrate (1); a phase (200) in which the surface which underwent the first stage of sacrificial oxidation is polished; and a third sacrificial oxidation phase whereby material making up the useful layer (6) is removed once more from the polished surface (17).
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公开(公告)号：EP1208589B1
公开(公告)日：2010-12-22
申请号：EP00958696.7
申请日：2000-08-17
IPC分类号： H01L21/324 , H01L21/306 , H01L21/762 , H01L21/18
CPC分类号： H01L21/3247 , H01L21/306 , H01L21/30625 , H01L21/76251 , Y10S438/974
摘要： The invention relates to a method for treating substrates (50) for microelectronics or optoelectronics, whereby said substrates comprise a useful layer (52) on at least one of the surfaces thereof. The inventive method includes a mechanical/chemical polishing step occurring on a bare surface (54) of the useful layer and is characterized in that it also comprises a post-curing step in a reductive atmosphere (100) before said polishing step occurs.
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公开(公告)号：EP1423244B9
公开(公告)日：2007-10-03
申请号：EP02794609.4
申请日：2002-07-24
CPC分类号： H01L21/67092 , B28D1/322 , B28D5/0005 , Y10T83/0476 , Y10T225/10 , Y10T225/30 , Y10T225/371
摘要： The invention relates to a method of splitting apart a substrate of two adjoining wafers defining between them a cleavage plane, by bringing each substrate into a substrate-receiving space; and clamping first and second jaw portions onto each substrate in such a manner as to hold each substrate and urge apart the two wafers of each substrate by co-operation between the shapes of housings in first and second portions of the two jaws, respectively. The invention also relates to a splitting method that includes bringing each substrate into a substrate-reception space; clamping together separator portions onto each substrate so as to split apart the two wafers of each substrate; and clamping the split-apart substrate wafers so as to hold the wafers together. An automated system for processing multiple substrates is also provided.
摘要翻译： 本发明涉及一种通过使每个衬底进入衬底容纳空间而将限定在它们之间的两个相邻晶片的衬底分开开裂平面的方法， 以及通过分别在两个夹爪的第一和第二部分中的壳体的形状之间的协作操作，将第一和第二夹爪部分夹持在每个基底上，以便夹持每个基底并促使每个基底的两个晶片分开。 本发明还涉及一种分裂方法，其包括使每个衬底进入衬底接收空间; 将分离器部分夹持在每个衬底上以便分开每个衬底的两个晶片; 并夹紧分开的基底晶片以将晶片保持在一起。 还提供了用于处理多个衬底的自动化系统。
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7.发明公开
公开(公告)号：EP1208593A1
公开(公告)日：2002-05-29
申请号：EP00958697.5
申请日：2000-08-17
发明人： BARGE, Thierry , GHYSELEN, Bruno , IWAMATSU, Toshiaki , NARUOKA, Hideki , FURIHATA, Junichiro , MITANI, Kiyoshi
IPC分类号： H01L21/762 , H01L21/306
CPC分类号： H01L21/306 , H01L21/30625 , H01L21/76254 , Y10T428/12528
摘要： The invention relates to a method for treating substrates (1) for microelectronics or opto-electronics, comprising a useful layer (6) which is at least partially composed of an oxidable material on at least one of the surfaces thereof. The inventive method consists of a first sacrificial oxidation phase whereby a certain thickness of the material making up the useful layer (6) can be removed from the surface of each substrate (1); a phase (200) in which the surface which underwent the first stage of sacrificial oxidation is polished; and a third sacrificial oxidation phase whereby material making up the useful layer (6) is removed once more from the polished surface (17).
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公开(公告)号：EP1423244B1
公开(公告)日：2007-03-21
申请号：EP02794609.4
申请日：2002-07-24
CPC分类号： H01L21/67092 , B28D1/322 , B28D5/0005 , Y10T83/0476 , Y10T225/10 , Y10T225/30 , Y10T225/371
摘要： The invention relates to a method of splitting apart a substrate of two adjoining wafers defining between them a cleavage plane, by bringing each substrate into a substrate-receiving space; and clamping first and second jaw portions onto each substrate in such a manner as to hold each substrate and urge apart the two wafers of each substrate by co-operation between the shapes of housings in first and second portions of the two jaws, respectively. The invention also relates to a splitting method that includes bringing each substrate into a substrate-reception space; clamping together separator portions onto each substrate so as to split apart the two wafers of each substrate; and clamping the split-apart substrate wafers so as to hold the wafers together. An automated system for processing multiple substrates is also provided.
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公开(公告)号：EP1385683B8
公开(公告)日：2006-12-20
申请号：EP02732797.2
申请日：2002-04-10
发明人： MARTINEZ, Muriel , BARGE, Thierry , SOUBIE, Alain , LAGAHE - Blanchard , Chrystelle , RAYSSAC, Olivier , Berne, Cécile
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
摘要： The invention relates to a device (40) for automatic high-precision cutting of a layer of material joined to a substrate source by means of an embrittled area, said source substrate and layer forming a set which is to be cut and said device comprising cutting means (531, 532) in addition to means (510) for maintaining the position of the set which is to be cut, characterized in that the cutting means comprise a blade which acts upon the set which is to be cut. The invention also relates to a method for using said device.
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公开(公告)号：EP1423244A1
公开(公告)日：2004-06-02
申请号：EP02794609.4
申请日：2002-07-24
CPC分类号： H01L21/67092 , B28D1/322 , B28D5/0005 , Y10T83/0476 , Y10T225/10 , Y10T225/30 , Y10T225/371
摘要： The invention relates to a method of splitting apart a substrate of two adjoining wafers defining between them a cleavage plane, by bringing each substrate into a substrate-receiving space; and clamping first and second jaw portions onto each substrate in such a manner as to hold each substrate and urge apart the two wafers of each substrate by co-operation between the shapes of housings in first and second portions of the two jaws, respectively. The invention also relates to a splitting method that includes bringing each substrate into a substrate-reception space; clamping together separator portions onto each substrate so as to split apart the two wafers of each substrate; and clamping the split-apart substrate wafers so as to hold the wafers together. An automated system for processing multiple substrates is also provided.
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