发明公开
EP1404903A1 PROZESSKAMMER MIT ABSCHNITTSWEISE UNTERSCHIEDLICH DREHANGETRIEBENEM BODEN UND SCHICHTABSCHEIDEVERFAHREN IN EINER DERARTIGEN PROZESSKAMMER
有权
第WAY不同楼层与DREHANGETRIEBENEM层沉积工艺室中,处理室
- 专利标题: PROZESSKAMMER MIT ABSCHNITTSWEISE UNTERSCHIEDLICH DREHANGETRIEBENEM BODEN UND SCHICHTABSCHEIDEVERFAHREN IN EINER DERARTIGEN PROZESSKAMMER
- 专利标题(英): Process chamber with a base with sectionally different rotational drive and layer deposition method in such a process chamber
- 专利标题(中): 第WAY不同楼层与DREHANGETRIEBENEM层沉积工艺室中,处理室
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申请号: EP02751008.0申请日: 2002-06-10
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公开(公告)号: EP1404903A1公开(公告)日: 2004-04-07
- 发明人: SCHWAMBERA, Markus , FRANKEN, Walter , STRAUCH, Gerd
- 申请人: Aixtron AG
- 申请人地址: Kackertstrasse 15-17 52072 Aachen DE
- 专利权人: Aixtron AG
- 当前专利权人: Aixtron AG
- 当前专利权人地址: Kackertstrasse 15-17 52072 Aachen DE
- 代理机构: Grundmann, Dirk, Dr.
- 优先权: DE10133914 20010712
- 国际公布: WO2003008675 20030130
- 主分类号: C30B25/12
- IPC分类号: C30B25/12 ; C23C16/458 ; C30B25/14 ; C23C16/455 ; C30B25/02
摘要:
The invention relates to a method for the deposition of, in particular crystalline layers on a substrate lying on rotating substrate holders (2) in a process chamber (1). The substrate holders (2) are arranged around the centre of a rotating substrate holder support. Said substrate holder support (3) forms a process chamber base (4) together with the substrate holders (2), which is opposite a process chamber cover (5) with a central gas inlet device (6), through which, together with a carrier gas, one or several gaseous starting materials may be introduced into a decomposition zone, arranged above a heated central region (4') of the process chamber floor (4), surrounded by a diffusion zone (4''), from which the decomposition products are transported radially outwards in the carrier gas stream to the substrate. According to the invention, the supply of decomposition products to the substrate may be equilibrated, whereby the central region (4') of the process chamber base (4) is rotated relative to the substrate holder support (3) and to the process chamber cover (5) or the gas inlet device (6).
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