发明公开
- 专利标题： Conductive silver paste and conductive film formed using the same
- 专利标题（中）： 维尔法赫尔·希尔斯顿·冯·莱特菲格
-
申请号： EP05251277.9申请日： 2005-03-03
-
公开(公告)号： EP1586604A1公开(公告)日： 2005-10-19
- 发明人: Kasuga, Takashi , Shimoda, Kohei , Yamakawa, Masahiro
- 申请人： Sumitomo Electric Industries, Ltd.
- 申请人地址： 5-33 Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541-0041 JP
- 专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人地址： 5-33 Kitahama 4-chome, Chuo-ku Osaka-shi, Osaka 541-0041 JP
- 代理机构： Cross, Rupert Edward Blount
- 优先权： JP2004059722 20040303
- 主分类号： C08K13/06
- IPC分类号： C08K13/06 ; H01B1/22
摘要：
A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 µm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 µm, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.
公开/授权文献
信息查询
