Conductive silver paste and conductive film formed using the same
    1.
    发明公开
    Conductive silver paste and conductive film formed using the same 有权
    维尔法赫尔·希尔斯顿·冯·莱特菲格

    公开(公告)号:EP1586604A1

    公开(公告)日:2005-10-19

    申请号:EP05251277.9

    申请日:2005-03-03

    IPC分类号: C08K13/06 H01B1/22

    CPC分类号: H05K1/095 H01B1/22

    摘要: A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 µm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 µm, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.

    摘要翻译: 根据本发明的导电性银糊剂包括环氧树脂,平均粒径为0.5〜50μm的鳞片状银粉末,其表面被有机物包覆的球状银粉末,平均粒径为 不超过1μm,根据本发明的导电膜是通过将导电性银膏印刷或涂布在基材的表面上,然后干燥而形成的,然后使环氧树脂热固化。