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公开(公告)号：EP1586604B1
公开(公告)日：2008-01-09
申请号：EP05251277.9
申请日：2005-03-03
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2.发明公开Substrate for printed wiring board, printed wiring board, and methods for producing same 审中-公开印刷线路板用基板，印刷线路板及其制造方法
公开(公告)号：EP2475234A2
公开(公告)日：2012-07-11
申请号：EP12162284.9
申请日：2010-04-13
发明人： Oka, Yoshio , Kasuga, Takashi , Okada, Issei , Mikage, Katsunari , Uenishi, Naota , Okuda, Yasuhiro
IPC分类号： H05K3/24
CPC分类号： H05K3/424 , C23C28/00 , C23C28/023 , C23C28/027 , H05K1/09 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/064 , H05K3/108 , H05K3/1241 , H05K3/1283 , H05K3/188 , H05K3/246 , H05K3/38 , H05K3/4038 , H05K3/4069 , H05K3/422 , H05K3/426 , H05K2201/0154
摘要： A substrate for a printed wiring board, comprising an insulating base and a conductive layer covering a surface of the base, wherein the base has a through-hole penetrating the base, and the conductive layer is composed of a conductive ink layer that covers the entire inner surface of the through-hole and an upper surface and a lower surface of the base and that contains metal particles.
摘要翻译： 1。一种印刷电路板用基板，其特征在于，具有绝缘性基体和覆盖所述基体表面的导电层，所述基体具有贯通所述基体的贯通孔，所述导电性层由导电性墨水层构成， 通孔的内表面和基座的上表面和下表面并且包含金属颗粒。
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3.发明公开Substrate for printed wiring board, printed wiring board, and methods for producing same 审中-公开一种用于印刷电路板衬底，印刷电路板和过程及其制备
公开(公告)号：EP2475234A3
公开(公告)日：2012-09-19
申请号：EP12162284.9
申请日：2010-04-13
发明人： Oka, Yoshio , Kasuga, Takashi , Okada, Issei , Mikage, Katsunari , Uenishi, Naota , Okuda, Yasuhiro
CPC分类号： H05K3/424 , C23C28/00 , C23C28/023 , C23C28/027 , H05K1/09 , H05K3/022 , H05K3/025 , H05K3/06 , H05K3/064 , H05K3/108 , H05K3/1241 , H05K3/1283 , H05K3/188 , H05K3/246 , H05K3/38 , H05K3/4038 , H05K3/4069 , H05K3/422 , H05K3/426 , H05K2201/0154
摘要： A substrate for a printed wiring board, comprising an insulating base and a conductive layer covering a surface of the base, wherein the base has a through-hole penetrating the base, and the conductive layer is composed of a conductive ink layer that covers the entire inner surface of the through-hole and an upper surface and a lower surface of the base and that contains metal particles.
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公开(公告)号：EP1586604A1
公开(公告)日：2005-10-19
申请号：EP05251277.9
申请日：2005-03-03
摘要： A conductive silver paste according to the present invention comprises epoxy resin, flake-shaped silver powders having an average particle diameter of 0.5 to 50 µm, and spherical silver powders, each having its surface coated with organic matter, having an average particle diameter of not more than 1 µm, and a conductive film according to the present invention is formed by printing or applying the conductive silver paste on a surface of a base material, followed by drying, and then thermosetting the epoxy resin.
摘要翻译： 根据本发明的导电性银糊剂包括环氧树脂，平均粒径为0.5〜50μm的鳞片状银粉末，其表面被有机物包覆的球状银粉末，平均粒径为 不超过1μm，根据本发明的导电膜是通过将导电性银膏印刷或涂布在基材的表面上，然后干燥而形成的，然后使环氧树脂热固化。
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