发明公开
- 专利标题： MULTI-CHEMISTRY PLATING SYSTEM
- 专利标题（中）： 具有多chemisms金属分离系统
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申请号： EP04760000.2申请日： 2004-04-16
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公开(公告)号： EP1694885A2公开(公告)日： 2006-08-30
- 发明人: YANG, Michael, X. , XI, Ming , BRITCHER, Eric, B. , DONOSO, Bernardo , PANG, Lily, L. , SHERMAN, Svetlana , HO, Henry , NGUYEN, Anh, N. , LERNER, Alexander, N. , D'AMBRA, Allen, L. , SHANMUGASUNDRAM, Arulkumar , ISHIKAWA, Tetsuya , RABINOVICH, Yevgeniy , LUBOMIRSKY, Dmitry , MOK, Yeuk-Fai, Edwin , NGUYEN, Son, T.
- 申请人： APPLIED MATERIALS, INC. , Ellwanger, Russell C.
- 申请人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 专利权人： APPLIED MATERIALS, INC.,Ellwanger, Russell C.
- 当前专利权人： APPLIED MATERIALS, INC.,Ellwanger, Russell C.
- 当前专利权人地址： 3050 Bowers Avenue Santa Clara, California 95054 US
- 代理机构： Bayliss, Geoffrey Cyril
- 优先权： US463860P 20030418; US463970P 20030418; US463861P 20030418; US463956P 20030418; US463862P 20030418
- 国际公布： WO2004094702 20041104
- 主分类号： C25D1/00
- IPC分类号： C25D1/00
摘要：
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
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