发明公开
- 专利标题： TIN-BASED COATING OF ELECTRONIC COMPONENT
- 专利标题（中）： 涂层锡为基础的电子元件
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申请号： EP05706011.3申请日： 2005-01-21
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公开(公告)号： EP1716732A2公开(公告)日： 2006-11-02
- 发明人: XU, Chen c/o Enthone Inc. , ZHANG, Yun c/o Enthone Inc. , FAN, Chonglun c/o Enthone Inc. , KHASELEV, Oscar c/o Enthone Inc. , ABYS, Joseph, A. c/o Enthone Inc. , WALCH, Eric , KLEINFELD, Marlies , ECKERT, Hans, Ullrich
- 申请人： ENTHONE, INCORPORATED
- 申请人地址： 350 Frontage Road West Haven, CT 06516 US
- 专利权人： ENTHONE, INCORPORATED
- 当前专利权人： ENTHONE, INCORPORATED
- 当前专利权人地址： 350 Frontage Road West Haven, CT 06516 US
- 代理机构： Stenger, Watzke & Ring
- 优先权： DE102004002982 20040121; US838571 20040504; US968500 20041019
- 国际公布： WO2005074026 20050811
- 主分类号： H05K3/34
- IPC分类号： H05K3/34
摘要：
A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
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