公开(公告)号：EP1716732A2

公开(公告)日：2006-11-02

申请号：EP05706011.3

申请日：2005-01-21

申请人： ENTHONE, INCORPORATED

发明人： XU, Chen c/o Enthone Inc. ,  ZHANG, Yun c/o Enthone Inc. ,  FAN, Chonglun c/o Enthone Inc. ,  KHASELEV, Oscar c/o Enthone Inc. ,  ABYS, Joseph, A. c/o Enthone Inc. ,  WALCH, Eric ,  KLEINFELD, Marlies ,  ECKERT, Hans, Ullrich

IPC分类号： H05K3/34

CPC分类号： H01L23/49582 ,  C25D5/12 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01R4/02 ,  H01R13/03 ,  H05K3/3426 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T428/12722 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.