发明授权
- 专利标题: LINKER COMPOUND, LIGAND COMPLEX AND PROCESS FOR PRODUCING THEM
- 专利标题(中): 接头化合物,配体复合物和方法及其
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申请号: EP05709791.7申请日: 2005-02-04
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公开(公告)号: EP1731517B1公开(公告)日: 2010-11-17
- 发明人: SUDA, Yasuo , ARANO, Akio , KUSUMOTO, Shoichi , SOBEL, Michael , WAKAO, Masahiro
- 申请人: Japan Science and Technology Agency , National University Corporation Kagoshima University
- 申请人地址: 1-8, Honcho 4-chome Kawaguchi-shi, Saitama 332-0012 JP
- 专利权人: Japan Science and Technology Agency,National University Corporation Kagoshima University
- 当前专利权人: Japan Science and Technology Agency,National University Corporation Kagoshima University
- 当前专利权人地址: 1-8, Honcho 4-chome Kawaguchi-shi, Saitama 332-0012 JP
- 代理机构: Coggi, Giorgio
- 优先权: JP2004029562 20040205
- 国际公布: WO2005075453 20050818
- 主分类号: C07D339/04
- IPC分类号: C07D339/04 ; C07H15/04 ; G01N33/543
摘要:
A novel linker compound that minimizes any nonspecific hydrophobic interactions and is capable of easily regulating the length to disulfide group subjected to metal bond to thereby enable efficient formation of metal-sulfur bond; a novel ligand complex or ligand carrying substance; and a process for producing them. There is provided a linker compound comprising the structure of the general formula: (1) (wherein each of a, b, d and e independently is an integer of 0 to 6). The above X at a molecular end has an aromatic amino group and at its main chain has a structure of multi-branched structural site composed of 3 or more hydrocarbon-derived chains optionally having carbon-nitrogen bonds. The ligand complex consists of the above linker compound having a sugar molecule introduced therein.
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