LINKER COMPOUND, LIGAND COMPLEX AND PROCESS FOR PRODUCING THEM
    4.
    发明公开
    LINKER COMPOUND, LIGAND COMPLEX AND PROCESS FOR PRODUCING THEM 有权
    LINKERVERBINDUNG,LIGANDENKOMPLEX UND VERFAHREN ZU DEREN HERSTELLUNG

    公开(公告)号:EP1731517A1

    公开(公告)日:2006-12-13

    申请号:EP05709791.7

    申请日:2005-02-04

    IPC分类号: C07D339/04 C07H15/04

    摘要: The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1)

    where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.

    摘要翻译: 本发明提供了一种新的接头化合物,其使任何非特异性疏水相互作用最小化,并且能够容易地将长度调节至经受金属键的二硫键,从而有效形成金属 - 硫键; 新型配体结合物和配体载体,及其制备方法。 连接体化合物具有下述通式(1)所示的结构,其中a,b,d,e独立地为0〜6的整数。X具有作为多支链结构部分的结构,包含3个以上的烃 衍生链,其中烃衍生物链各自在其末端包括芳族氨基,并且在其主链中可以包括或不包括碳 - 氮键。 配体缀合物包括其中引入糖分子的连接体化合物。