发明公开
- 专利标题： VORRICHTUNG ZUM VORBEHANDELN VON SUBSTRATEN
- 专利标题（英）： Device for the pre-treatment of substrates
- 专利标题（中）： 设备用于预处理SUBSTRATES
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申请号： EP07819513.8申请日： 2007-10-31
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公开(公告)号： EP2087503A1公开(公告)日： 2009-08-12
- 发明人: HEINSS, Jens-Peter , KIRCHHOFF, Volker , KLOSE, Lars , METZNER, Christoph , MORGNER, Henry , SCHEFFEL, Bert
- 申请人： Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V.
- 申请人地址： Hansastrasse 27c 80686 München DE
- 专利权人： Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V.
- 当前专利权人： Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V.
- 当前专利权人地址： Hansastrasse 27c 80686 München DE
- 优先权： DE202006017024U 20061107
- 国际公布： WO2008055617 20080515
- 主分类号： H01J37/32
- IPC分类号： H01J37/32
摘要：
The invention relates to a device for the pre-treatment of at least one substrate (21), comprising a low voltage arc discharge source (24; 25) disposed in a vacuum chamber (22) for generating a plasma (26), from which charge carriers can be extracted, which can be applied to the surface of the substrate (21), wherein the substrate (21) is connected to the electric vacuum chamber mass (28), and a BIAS voltage is switched to accelerate the charge carriers on the substrate surface between the substrate (21) and the vacuum chamber mass (28), on one hand, and an electrode (25) close to a plasma potential in terms of voltage is switched, on the other hand.
公开/授权文献
- EP2087503B1 VORRICHTUNG ZUM VORBEHANDELN VON SUBSTRATEN 公开/授权日：2013-12-11
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