发明公开
- 专利标题： GOLD ALLOY WIRE FOR BALL BONDING
- 专利标题（中）： GOLDLEGIERUNGSDRAHT ZUM BALLBONDING
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申请号： EP08790566.7申请日： 2008-06-23
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公开(公告)号： EP2204846A1公开(公告)日： 2010-07-07
- 发明人: TAKADA, Mitsuo , TESHIMA, Satoshi , KUWAHARA, Takeshi
- 申请人： Tanaka Denshi Kogyo K.K.
- 申请人地址： Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 专利权人： Tanaka Denshi Kogyo K.K.
- 当前专利权人： Tanaka Denshi Kogyo K.K.
- 当前专利权人地址： Tokyo Building 22F 7-3 Marunouchi 2-chome Chiyoda-ku Tokyo 100-6422 JP
- 代理机构： Müller & Schubert
- 优先权： JP2007276104 20071024
- 国际公布： WO2009054164 20090430
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; C22C5/02
摘要：
[PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.
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