公开(公告)号：EP2204846A1

公开(公告)日：2010-07-07

申请号：EP08790566.7

申请日：2008-06-23

申请人： Tanaka Denshi Kogyo K.K.

发明人： TAKADA, Mitsuo ,  TESHIMA, Satoshi ,  KUWAHARA, Takeshi

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： H01L24/85 ,  B23K35/3013 ,  B23K2201/36 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01105 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20106 ,  H01L2924/20752 ,  Y10T428/12 ,  H01L2924/01012 ,  H01L2924/01063 ,  H01L2924/0105 ,  H01L2924/0102 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00015 ,  H01L2924/01205 ,  H01L2924/01048 ,  H01L2924/00013 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [PROBLEMS] To provide a gold alloy wire which is excellent in the property of forming a melt ball, suitability for stitch bonding, and wire strength and, despite this, gives a press-bonded ball having excellent circularity, and which is usable in high-density wiring for a semiconductor device. [MEANS FOR SOLVING PROBLEMS] The gold alloy wire for use in ball bonding is made of a gold alloy comprising 10-50 mass ppm magnesium (Mg), 5-20 mass ppm europium (Eu), 2-9 mass ppm calcium (Ca), and gold (Au) having a purity of 99.995 mass% or higher as the remainder, wherein the calcium (Ca) content is up to half the europium (Eu) content by mass.

摘要翻译： 本发明提供一种熔融球形成性优异，缝合适应性和线强度高的金合金丝，尽管如此，可提供圆形性优异的压接球，可高效使用 半导体器件的密度布线。 解决问题的手段用于球接的金合金线由含有10-50质量ppm镁（Mg），5-20质量ppm铕（Eu），2-9质量ppm钙（Ca ）和纯度为99.995质量％以上的金（Au）余量，其中钙（Ca）含量高达铕（Eu）含量的一半。

公开(公告)号：EP2209136A1

公开(公告)日：2010-07-21

申请号：EP08846626.3

申请日：2008-10-15

申请人： Tanaka Denshi Kogyo K.K.

发明人： TAKADA, Mitsuo ,  TESHIMA, Satoshi ,  KUWAHARA, Takeshi

IPC分类号： H01L21/60 ,  C22C5/02

CPC分类号： H01L24/85 ,  C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85045 ,  H01L2224/85048 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01105 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/01039 ,  H01L2924/00014 ,  H01L2924/01202 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00015 ,  H01L2924/01049 ,  H01L2924/01006

摘要： [Issues to be solved]
To provide Au alloy wire for ball bonding, which is superior wire strength, and also is superior at formability of molten ball and roundness of compressed ball, moreover is superior at stitch bondability; is available for high density wiring of semiconductor divices.
[Solution means]
Au alloy wire for ball bonding comprising: 15 - 50 wt ppm Mg, 10 - 30 wt ppm Ca, 5 - 20 wt ppm Eu, 5 - 20 wt ppm Y, 5 - 20 wt ppm La and residual Au is more than 99.998 wt % purity, moreover, purity of more than 99.98 wt % Au, mass of additive Ca is less than the value of total amount of additive Eu and additive La, and mass of additive Y is less than the value of total amount of additive Ca and additive Eu, and mass of 20 - 40 wt ppm Mg.