发明公开
- 专利标题： A METHOD OF ASSEMBLING WAFERS BY MOLECULAR BONDING
- 专利标题（中）： 法在施工WAFERS用分子绑定机制
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申请号： EP09742018.6申请日： 2009-04-30
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公开(公告)号： EP2272084A2公开(公告)日： 2011-01-12
- 发明人: BROEKAART, Marcel , ASPAR, Bernard , LAGAHE, Chrystelle , BARGE, Thierry
- 申请人： S.O.I.Tec Silicon on Insulator Technologies
- 申请人地址： Parc Technologique des Fontaines Chemin des Franques 38190 Bernin FR
- 专利权人： S.O.I.Tec Silicon on Insulator Technologies
- 当前专利权人： S.O.I.Tec Silicon on Insulator Technologies
- 当前专利权人地址： Parc Technologique des Fontaines Chemin des Franques 38190 Bernin FR
- 代理机构： Desormiere, Pierre-Louis
- 优先权： FR0852990 20080506
- 国际公布： WO2009135800 20091112
- 主分类号： H01L21/18
- IPC分类号： H01L21/18 ; H01L27/146 ; H01L25/065 ; H01L21/98
摘要：
The invention concerns a method of bonding two wafers (20, 30) by molecular bonding in which a first propagation of a bonding wave initiated from a point of pressure (43) applied to at least one (30) of the two wafers is followed by a second propagation of the bonding wave over a zone covering the point of pressure (43). The second bonding wave propagation may be obtained by interposing a separating element (41) between the two wafers and by withdrawing the element at least after the start of the first bonding wave propagation or by partially unbonding the surfaces of the assembled wafers over a zone located in the vicinity of the point of pressure (63).
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