The invention relates to the electroplating of substrates for use as e.g. wafers, solar cells or hybrids in process chambers or cups having soluble or insoluble anodes and an electrolyte (8), which is conducted through the process chamber in a circuit. The invention also relates to the stripping of contacts that are metallised during the electroplating process. Two electrolytic operating conditions are produced in the process chamber, i.e. electroplating and stripping. The invention optimises these two operating conditions using one modular unit (2), substantially consisting of an anode carrier (3) and at least one liquid-permeable material (5) as the diffuser (5). For the electroplating process, a homogeneous stream of the electrolyte (8) is required in the process chamber in the vicinity of the product (1) to be electroplated. This is achieved by a corresponding adjustment of the static pressure below the diffuser (5) and as a result of the permeability characteristics of the latter with regard to the electrolyte. The volumetric flow of electrolyte (8) is increased during the stripping of the product supports which act as the electrical contact. The flow passes through the clearance zone (4) and then predominantly directly through the diffuser (5) that lies above the clearance zone (4). As a result, different flow speeds are present over the cross-section of the process chamber. This causes turbulence with wave formation on the surface of the electrolyte. Without the presence of a product, the electrolyte washes over the product supports, rapidly stripping the contacts completely with a high flow density.