发明公开
- 专利标题： VERFAHREN ZUM HERSTELLEN EINER ELEKTRONISCHEN BAUGRUPPE
- 专利标题（英）： Method for producing an electronic assembly
- 专利标题（中）： 方法用于制造电子组件
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申请号： EP13811837.7申请日： 2013-12-10
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公开(公告)号： EP2936553A1公开(公告)日： 2015-10-28
- 发明人: BIEBRICHER, Lothar , SCHULMEISTER, Michael , SCHILLINGER, Jakob , HUBER, Dietmar , FISCHER, Thomas , GÜNTHNER, Stefan , BAUMUNG, Waldemar
- 申请人： Continental Teves AG&Co. Ohg
- 申请人地址： Guerickestraße 7 60488 Frankfurt DE
- 专利权人： Continental Teves AG&Co. Ohg
- 当前专利权人： Continental Teves AG&Co. Ohg
- 当前专利权人地址： Guerickestraße 7 60488 Frankfurt DE
- 优先权： DE102012223982 20121220
- 国际公布： WO2014095500 20140626
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/31 ; H01L23/552
摘要：
The invention relates to a method for producing an electronic assembly (14) in which an electronic component (26, 30) supported on a wiring support (32) is encapsulated with an encapsulation material (38), the method comprising: - arranging the electronic component (26, 30) on the wiring support (32) in such a manner that a stress applied onto the electronic component (26, 30) by the encapsulation material (38) falls below a predetermined value; and - encapsulating the electronic component (26, 30) with the encapsulation material (38).
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