-
公开(公告)号：EP2936553A1
公开(公告)日：2015-10-28
申请号：EP13811837.7
申请日：2013-12-10
发明人： BIEBRICHER, Lothar , SCHULMEISTER, Michael , SCHILLINGER, Jakob , HUBER, Dietmar , FISCHER, Thomas , GÜNTHNER, Stefan , BAUMUNG, Waldemar
IPC分类号： H01L23/00 , H01L23/31 , H01L23/552
CPC分类号： H05K3/30 , H01L23/3121 , H01L23/3128 , H01L23/3135 , H01L23/495 , H01L23/552 , H01L23/562 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/04042 , H01L2224/16145 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2924/19105 , H05K1/186 , Y10T29/49147 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The invention relates to a method for producing an electronic assembly (14) in which an electronic component (26, 30) supported on a wiring support (32) is encapsulated with an encapsulation material (38), the method comprising: - arranging the electronic component (26, 30) on the wiring support (32) in such a manner that a stress applied onto the electronic component (26, 30) by the encapsulation material (38) falls below a predetermined value; and - encapsulating the electronic component (26, 30) with the encapsulation material (38).
-
公开(公告)号：EP3452791A1
公开(公告)日：2019-03-13
申请号：EP17713929.2
申请日：2017-03-27
-
公开(公告)号：EP3384560A1
公开(公告)日：2018-10-10
申请号：EP16777645.9
申请日：2016-09-29
摘要： The invention relates to a conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.
-
4.发明公开NEUTRALTEIL FÜR EINEN KUNDENSPEZIFISCH ADAPTIERBAREN SENSOR 审中-公开NEUTRALTEILFÜREINEN KUNDENSPEZIFISCH ADAPTIERBAREN SENSOR
公开(公告)号：EP3167249A1
公开(公告)日：2017-05-17
申请号：EP15788333.1
申请日：2015-07-15
摘要： The invention relates to a method for producing a sensor (28) comprising a circuit carrier (44) which comprises an assembly island (48) which supports a sensor circuit (35, 40) for emitting a sensor signal (42) dependent on a physical transmitting field (33), and an interface (52) which is electrically connected to the assembly island (48) and which transmits the sensor signal (42) to a superordinate signal processing device (18). Said method comprises the following steps: Enveloping one part of the circuit carrier (44) containing the assembly island (48) and the sensor circuit (35, 40) in a first protective compound (68); connecting a signal transmission element (74) to the interface (52); enveloping at least one part of the first protective compound (68) and the interface (52) to at least one part of the signal transmission element (74) connected thereto in a second protective compound (78).
摘要翻译： 本发明涉及一种用于制造包括电路载体（44）的传感器（28）的方法，所述电路载体（44）包括支撑传感器电路（35,40）的组装岛（48），所述传感器电路用于发射取决于物理 （33）以及电连接到组装岛（48）并将传感器信号（42）传输到上级信号处理装置（18）的接口（52）。 所述方法包括以下步骤：将包含组装岛（48）和传感器电路（35,40）的电路载体（44）的一部分包围在第一保护性化合物（68）中; 将信号传输元件（74）连接到接口（52）; 在第二保护性化合物（78）中包封第一保护性化合物（68）和界面（52）的至少一部分至与其连接的信号传输元件（74）的至少一部分。
-
公开(公告)号：EP2338034B1
公开(公告)日：2016-12-14
申请号：EP09783642.3
申请日：2009-10-01
发明人： DE VOLDER, Edmond , HUBER, Dietmar , DÖRING, Andreas , SCHILLINGER, Jakob , WATZLAWIK, Martin , BIEBRICHER, Lothar
CPC分类号： B29C45/14065 , B29C33/126 , B29C45/14655 , B29C45/1671 , G01D11/245 , G01P1/026 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T29/49121 , Y10T29/4921 , H01L2924/00014 , H01L2924/00 , H01L2924/01046 , H01L2924/00012
-
公开(公告)号：EP2880682A1
公开(公告)日：2015-06-10
申请号：EP13745626.5
申请日：2013-07-30
IPC分类号： H01L23/31 , G01D11/24 , H01L23/495
CPC分类号： H05K7/02 , G01C19/5783 , G01P1/023 , H01L23/3107 , H01L23/49503 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , H05K3/30 , H05K5/0078 , Y10T29/4913 , H01L2924/00
摘要： The invention relates to a wiring device (34) for wiring an electronic apparatus (14) comprising an interface (42), a conductor track (40) and a component fitting island (38) that is connected to the interface (42) via the conductor track (40) and that is set up to carry an electronic component (26, 28) and to make electrical contact with the interface (42) via the electrical conductor track (40), wherein the component fitting island (38) is free of a web element (58) that is set up to hold the component fitting island (38) on a support element (56) during a housing process housing the component fitting island (38).
摘要翻译： 一种用于布线电子设备的布线装置，包括界面，导体轨道和组件配合岛，该接口，导体轨道和组件配合岛经由导体轨道连接到接口，该导体轨道设置为承载电子部件，并通过电气与接口电接触 导体轨道，其中所述部件配合岛在容纳所述部件配合岛的壳体过程期间没有被设置成将所述部件配合岛保持在支撑元件上的腹板元件。
-
公开(公告)号：EP3459326A1
公开(公告)日：2019-03-27
申请号：EP17723680.9
申请日：2017-05-12
-
公开(公告)号：EP3074730B1
公开(公告)日：2017-09-27
申请号：EP14808561.6
申请日：2014-11-27
发明人： FISCHER, Thomas , BIEBRICHER, Lothar , SCHILLINGER, Jakob , HUBER, Dietmar , SCHULMEISTER, Michael , GÜNTHNER, Stefan
CPC分类号： B29C45/14819 , B29C45/14065 , B29C45/14221 , B29C45/14639 , B29C45/16 , B29C45/1671 , B29C2045/14122 , B29C2045/14131 , B29C2045/14139 , B29K2995/0069 , B29L2031/34 , B29L2031/3481 , G01D11/245
-
9.发明公开KÖRPERSCHALLENTKOPPLUNG AN MIT GEBERFELDERN ARBEITENDEN SENSOREN 审中-公开KÖRPERSCHALLENTKOPPLUNGMIT麻省理工学院ARBEITENDEN SENSOREN
公开(公告)号：EP3167253A1
公开(公告)日：2017-05-17
申请号：EP15732631.5
申请日：2015-06-25
发明人： FISCHER, Thomas , SCHILLINGER, Jakob , HUBER, Dietmar , GÜNTHNER, Stefan , BIEBRICHER, Lothar , SCHULMEISTER, Michael
CPC分类号： G01C19/5733 , B60W10/06 , B60W10/184 , B60W30/02 , B60W2520/105 , B60W2520/14 , B60W2720/00 , G01C19/5769 , G01D11/10 , G01D11/30 , G01P1/003 , G01P15/08 , H01L2224/48137 , H01L2224/49171
摘要： The invention relates to a sensor (14) for sensing a physical transmitter field (32, 38) dependent on a physical quantity (16) to be measured, comprising: a sensor circuit (46) for sensing the transmitter field (32, 38) and for outputting a sensor signal (26, 28) dependent on the transmitter field (32, 38), a circuit carrier (48) having a first region (68) in which at least a part (34) of the sensor circuit (46) is supported and a second region (70) in which at least a first mechanical interface (52) and a second mechanical interface (52) for connecting the circuit carrier (48) to a retainer (56) are arranged, and - a noise resistance element (66), which is arranged between the first region (68) and the second region (70) and which is designed to conduct structure-borne noise (64) entering via the first mechanical interface (52) to the second mechanical interface (52).
摘要翻译： 本发明涉及用于根据待测量的物理量（16）来感测物理发射器场（32,38）的传感器（14），包括：用于感测发射器场（32,38）的传感器电路（46） 并且用于输出取决于发射器场（32,38）的传感器信号（26,28），具有第一区域（68）的电路载体（48），其中传感器电路（46）的至少一部分（34） ）被支撑，并且第二区域（70）中布置有用于将电路载体（48）连接到保持器（56）的至少第一机械接口（52）和第二机械接口（52），以及 - 噪声 （66），其布置在第一区域（68）和第二区域（70）之间并且被设计成将经由第一机械接口（52）进入的结构噪声（64）传导到第二机械接口 （52）。
-
10.发明公开WERKZEUG ZUM URFORMEN EINES GEHÄUSES FÜR EINEN SENSOR 审中-公开WERKZEUG ZUM URFORMEN EINESGEHÄUSESFÜREINEN SENSOR
公开(公告)号：EP3074729A1
公开(公告)日：2016-10-05
申请号：EP14786470.6
申请日：2014-10-08
CPC分类号： G01R33/0052 , B29C39/021 , B29C39/04 , B29C39/10 , B29C39/38 , B29C45/0025 , B29C45/14 , B29C45/1635 , B29C45/26 , B29C2045/1785 , B29K2101/12 , B29L2031/3481 , G01D11/245 , G01R33/0047
摘要： The invention relates to a tool (59) for the primary shaping of a housing (56) for a sensor (28) which is designed to capture, via a sensing element (35), a physical area (33) that is dependent on a variable (12) to be measured, and to emit an electrical output signal (42) on the basis of the captured physical area (33), comprising: – a mould cavity (66) for receiving a material (68) that moulds the housing (56), and the sensing element (35), and – a box having a wall that bounds the mould cavity (66), wherein at least a part (60 to 64) of the wall that bounds the mould cavity (66) is mounted in a displaceable manner.
摘要翻译： 用于传感器壳体的初级成形的工具，其被设计成经由感测元件捕获取决于待测量的变量的物理区域，并且基于所捕获的物理量发射电输出信号 区域，包括：用于接收模制壳体的材料的模腔和感测元件;以及具有界定模腔的壁的盒，其中安装限定模腔的壁的至少一部分被安装 以可移位的方式。
-
-
-
-
-
-
-
-
-
搜索结果
22 条记录 (耗时 0.018 秒)
