摘要:
The invention relates to a sensor (14) for sensing a physical transmitter field (32, 38) dependent on a physical quantity (16) to be measured, comprising: a sensor circuit (46) for sensing the transmitter field (32, 38) and for outputting a sensor signal (26, 28) dependent on the transmitter field (32, 38), a circuit carrier (48) having a first region (68) in which at least a part (34) of the sensor circuit (46) is supported and a second region (70) in which at least a first mechanical interface (52) and a second mechanical interface (52) for connecting the circuit carrier (48) to a retainer (56) are arranged, and - a noise resistance element (66), which is arranged between the first region (68) and the second region (70) and which is designed to conduct structure-borne noise (64) entering via the first mechanical interface (52) to the second mechanical interface (52).
摘要:
The invention relates to a sensor (28) for detecting a physical variable (20), comprising: – a sensor element (35) for outputting an electrical signal (39) dependent on the physical variable (20), – a substrate (67) carrying the sensor element (35), – a printed circuit board (68), conducting the electrical signal (39), on the substrate (68), and – an embedding compound (70), in which the sensor element (35) is completely embedded and the printed circuit board (68) is at least partly embedded, – wherein at least one compensation element (40, 70', 76) is embodied in the embedding compound (70), by means of which compensation element a mechanical stress (73) caused by an element of the sensor (28) at least partly embedded in the embedding compound (70) is counteracted.
摘要:
The invention relates to a component (65) for a sensor (28) having a sensor element (35) and having an output interface (67) for the outputting of an electrical signal, which is dependent on a physical variable (20), from the sensor element (35) to the output interface (67), comprising – a circuit with at least one first signal path (70) for receiving the electrical signal (42) from the sensor element (35) and for conducting the electrical signal (42) to the output interface (67), and a second signal path (70), which differs from the first signal path (70), for conducting the electrical signal (42) to the output interface (67), - wherein an activity of the first signal path (70) or of the second signal path (70) is dependent on a position of the component (65) in the sensor (28).
摘要:
The invention relates to a method for producing an electronic assembly (14) in which an electronic component (26, 30) supported on a wiring support (32) is encapsulated with an encapsulation material (38), the method comprising: - arranging the electronic component (26, 30) on the wiring support (32) in such a manner that a stress applied onto the electronic component (26, 30) by the encapsulation material (38) falls below a predetermined value; and - encapsulating the electronic component (26, 30) with the encapsulation material (38).