发明公开
EP3021651A1 METHOD OF MOUNTING COMPONENT ONTO SUBSTRATE IN COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DEVICE 审中-公开
方法部件安装在基材在部件安装设备和元件安装装置

METHOD OF MOUNTING COMPONENT ONTO SUBSTRATE IN COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DEVICE
摘要:
Productivity is improved by reducing a cycle time that is required for assembly as a result of reducing a number of repetitions of a pressing step for assembling each section of a component on a board. The method for assembling a component on a board according to the present invention is configured by a transfer pressing step (Step S102) that assembles a target gripping location of a component 30 by gripping the target gripping location using a component transfer device 19, performing positioning, and applying a pressing force to a board S1 side, and a pressing step (Step S104) that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws 25 of a component gripping device 20 in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.
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