发明公开
EP3021651A1 METHOD OF MOUNTING COMPONENT ONTO SUBSTRATE IN COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DEVICE
审中-公开
方法部件安装在基材在部件安装设备和元件安装装置
- 专利标题: METHOD OF MOUNTING COMPONENT ONTO SUBSTRATE IN COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING DEVICE
- 专利标题(中): 方法部件安装在基材在部件安装设备和元件安装装置
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申请号: EP13889139.5申请日: 2013-07-12
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公开(公告)号: EP3021651A1公开(公告)日: 2016-05-18
- 发明人: SANJI Mitsuru
- 申请人: Fuji Machine Mfg. Co., Ltd.
- 申请人地址: 19, Chausuyama Yamamachi Chiryu-shi, Aichi 472-8686 JP
- 专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人: Fuji Machine Mfg. Co., Ltd.
- 当前专利权人地址: 19, Chausuyama Yamamachi Chiryu-shi, Aichi 472-8686 JP
- 代理机构: Grünecker Patent- und Rechtsanwälte PartG mbB
- 国际公布: WO2015004813 20150115
- 主分类号: H05K13/04
- IPC分类号: H05K13/04
摘要:
Productivity is improved by reducing a cycle time that is required for assembly as a result of reducing a number of repetitions of a pressing step for assembling each section of a component on a board. The method for assembling a component on a board according to the present invention is configured by a transfer pressing step (Step S102) that assembles a target gripping location of a component 30 by gripping the target gripping location using a component transfer device 19, performing positioning, and applying a pressing force to a board S1 side, and a pressing step (Step S104) that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws 25 of a component gripping device 20 in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.
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