公开(公告)号：EP3021651A1

公开(公告)日：2016-05-18

申请号：EP13889139.5

申请日：2013-07-12

申请人： Fuji Machine Mfg. Co., Ltd.

发明人： SANJI Mitsuru

IPC分类号： H05K13/04

CPC分类号： H05K13/0404 ,  H05K3/30

摘要： Productivity is improved by reducing a cycle time that is required for assembly as a result of reducing a number of repetitions of a pressing step for assembling each section of a component on a board. The method for assembling a component on a board according to the present invention is configured by a transfer pressing step (Step S102) that assembles a target gripping location of a component 30 by gripping the target gripping location using a component transfer device 19, performing positioning, and applying a pressing force to a board S1 side, and a pressing step (Step S104) that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws 25 of a component gripping device 20 in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.

摘要翻译： 生产率是通过降低并需要组件减少了许多压制步骤的重复，用于在电路板装配的部件的每个部分的结果的周期时间改进。 用于在电路板装配安装组件雅鼎在本发明的方法是通过转印压制步骤（步骤S102）配置的DID组装一个目标通过抓握目标使用的元件移载装置19夹持的位置，进行定位夹持部件30的位置 和施加压力到电路板S1侧，和一个压制步骤（步骤S104）那样同时通过定位至少两个保持爪在预定位置夹持装置20的组件25，以及将组装部件的每个相应的部分 使用各保持爪按压力在基板侧上的分量。

公开(公告)号：EP3021652A1

公开(公告)日：2016-05-18

申请号：EP13889164.3

申请日：2013-07-09

申请人： Fuji Machine Mfg. Co., Ltd.

发明人： SANJI Mitsuru

IPC分类号： H05K13/04

CPC分类号： H05K13/08 ,  G05B19/41865 ,  G05B2219/34349 ,  H05K13/0404 ,  H05K13/0452

摘要： The present specification discloses a method of allocating electronic components to be mounted to each of a plurality of nozzle holders provided on a mounting head. In the method, the electronic component which does not have a usage record or the electronic component which is a test target is allocated to a nozzle holder which does not have operation restrictions. The present specification also discloses an electronic component mounting system which is provided with a mounting head which is provided with a plurality of nozzle holders, each of which holds a suction nozzle, and a control device which allocates electronic components to be mounted to each of the plurality of nozzle holders. In the electronic component mounting system, the control device includes an electronic component allocation section which allocates an electronic component which does not have a usage record or an electronic component which is a test target to a nozzle holder which does not have operation restrictions.

摘要翻译： 本说明书盘松动分配的电子组件的方法，将被安装到每个设置在安装头喷嘴保持器的多个。 在该方法中，其不具有使用记录或电子部件的所有其是测试目标被分配到喷嘴保持器不具有操作限制的电子组件。 其设置有一安装头的电子部件安装系统上，因此，在本说明书盘松动所有这一切都被提供有喷嘴保持器，其中的每一个保持吸嘴的多个，并且其中分配电子元件的控制装置被安装到每个 喷嘴保持件的多个。 在该电子部件安装系统中，控制装置包括位于电子部件分配部分配哪个不具有使用记录或电子部件的所有其是测试目标到喷嘴保持器不具有业务限制电子元件的哪个。