发明公开
EP3290453A1 EPOXY RESIN COMPOSITION, THERMOCONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT-DISSIPATING MATERIAL, LAMINATED PLATE, METAL SUBSTRATE, AND PRINTED CIRCUIT BOARD
审中-公开
环氧树脂组合物，导热材料前体，B阶片材，预浸料，散热材料，层压板，金属基材和印刷电路板
- 专利标题： EPOXY RESIN COMPOSITION, THERMOCONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT-DISSIPATING MATERIAL, LAMINATED PLATE, METAL SUBSTRATE, AND PRINTED CIRCUIT BOARD
- 专利标题（中）： 环氧树脂组合物，导热材料前体，B阶片材，预浸料，散热材料，层压板，金属基材和印刷电路板
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申请号： EP16799965.5申请日： 2016-05-20
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公开(公告)号： EP3290453A1公开(公告)日： 2018-03-07
- 发明人: TAKEZAWA, Yoshitaka , TANAKA, Shingo , HOJO, Fusao
- 申请人： Hitachi Chemical Co., Ltd.
- 申请人地址： 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 JP
- 专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人地址： 9-2, Marunouchi 1-chome Chiyoda-ku Tokyo 100-6606 JP
- 代理机构： Hoffmann Eitle
- 优先权： JP2015104427 20150522
- 国际公布： WO2016190260 20161201
- 主分类号： C08G59/24
- IPC分类号： C08G59/24 ; B32B15/092 ; B32B27/18 ; B32B27/26 ; B32B27/38 ; C08J5/24 ; C08K3/38 ; C08L63/00 ; H05K1/03
摘要：
Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.
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