- 专利标题： MIKROELEKTRONISCHE BAUELEMENTANORDNUNG, SYSTEM MIT EINER MIKROELEKTRONISCHEN BAUELEMENTANORDNUNG UND ENTSPRECHENDES HERSTELLUNGSVERFAHREN FÜR EINE MIKROELEKTRONISCHE BAUELEMENTANORDNUNG
- 专利标题（英）： EP3342147A1 - Microelectronic component assembly, system having a microelectronic component assembly, and corresponding production method for a microelectronic component assembly
-
申请号： EP16750125.3申请日： 2016-07-26
-
公开(公告)号： EP3342147A1公开(公告)日： 2018-07-04
- 发明人: HERRMANN, Ingo , UTERMOEHLEN, Fabian , HENRICI, Fabian
- 申请人： Robert Bosch GmbH
- 申请人地址： Postfach 30 02 20 70442 Stuttgart DE
- 专利权人： Robert Bosch GmbH
- 当前专利权人： Robert Bosch GmbH
- 当前专利权人地址： Postfach 30 02 20 70442 Stuttgart DE
- 优先权： DE102015216461 20150828
- 国际公布： WO2017036675 20170309
- 主分类号： H04N5/225
- IPC分类号： H04N5/225 ; G01J5/00 ; G01J5/04 ; G01J5/10 ; H01L27/00 ; H01L31/00
摘要：
The invention relates to a microelectronic component assembly (100) having a sensor chip (1) for recording thermographic images. The sensor chip (1) has a front side (VS), a back side (RS), and a lateral surface (SF), which connects the front side (VS) to the back side (RS). The microelectronic component assembly (100) also comprises at least one evaluating circuit (A1), wherein the at least one evaluating circuit (A1) is in contact with the sensor chip (1) at least in some regions on the back side (RS) and/or the lateral surface (SF) of the sensor chip (1), and a lens, wherein the lens (L1) is arranged on the front side (VS) of the sensor chip (1) and covers the sensor chip (1), wherein the lateral surface (SF) of the sensor chip (1) and/or a lateral surface (SA) of the evaluating circuit (A1) and a lateral surface (SL) of the lens (L1) have traces of mechanical removal at least in some regions.
公开/授权文献
信息查询
