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1.发明公开
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公开(公告)号：EP3342147A1
公开(公告)日：2018-07-04
申请号：EP16750125.3
申请日：2016-07-26
申请人： Robert Bosch GmbH
摘要： The invention relates to a microelectronic component assembly (100) having a sensor chip (1) for recording thermographic images. The sensor chip (1) has a front side (VS), a back side (RS), and a lateral surface (SF), which connects the front side (VS) to the back side (RS). The microelectronic component assembly (100) also comprises at least one evaluating circuit (A1), wherein the at least one evaluating circuit (A1) is in contact with the sensor chip (1) at least in some regions on the back side (RS) and/or the lateral surface (SF) of the sensor chip (1), and a lens, wherein the lens (L1) is arranged on the front side (VS) of the sensor chip (1) and covers the sensor chip (1), wherein the lateral surface (SF) of the sensor chip (1) and/or a lateral surface (SA) of the evaluating circuit (A1) and a lateral surface (SL) of the lens (L1) have traces of mechanical removal at least in some regions.
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公开(公告)号：EP3365634B1
公开(公告)日：2020-03-25
申请号：EP16781126.4
申请日：2016-10-13
申请人： Robert Bosch GmbH
发明人： HERRMANN, Ingo , BUCK, Thomas , UTERMOEHLEN, Fabian , MERZ, Andreas , OSHINUBI, Dayo , KRAYL, Oliver , LEIDICH, Stefan
IPC分类号： G01D5/20
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5.发明授权
公开(公告)号：EP3455592B1
公开(公告)日：2020-03-18
申请号：EP17721376.6
申请日：2017-05-04
申请人： Robert Bosch GmbH
IPC分类号： G01D5/20
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6.发明公开
公开(公告)号：EP3455592A1
公开(公告)日：2019-03-20
申请号：EP17721376.6
申请日：2017-05-04
申请人： Robert Bosch GmbH
IPC分类号： G01D5/20
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7.发明公开
公开(公告)号：EP2850659A1
公开(公告)日：2015-03-25
申请号：EP13718171.5
申请日：2013-04-19
申请人： Robert Bosch GmbH
IPC分类号： H01L27/146 , G01J5/20
CPC分类号： H01L27/14649 , G01J5/20 , G01J2005/0048 , G01J2005/067 , H01L27/14609 , H01L27/14629 , H01L27/14636 , H01L27/1467 , H01L27/14685 , H01L31/028
摘要： The invention relates to an infrared sensor device (100; 200; 300), comprising a semiconductor substrate (1), at least one sensor element (2) micromechanically formed in the semiconductor substrate (1), and at least one calibration element (3), micromechanically formed in the semiconductor substrate (1), for the sensor element (2), wherein absorber material (6) is arranged on the semiconductor substrate (1) in the area of the sensor element (2) and the calibration element (3), wherein one cavern (8) each is formed in the semiconductor substrate (1) substantially below the sensor element (2) and substantially below the calibration element (3), wherein the sensor element (2) and the calibration element (3) are thermally and electrically isolated from the rest of the semiconductor substrate (1) by means of the caverns (8). High sensitivity, calibration functionality for the sensor element, and a high signal-to-noise ratio are thereby achieved for the infrared sensor device.
摘要翻译： 本发明涉及一种红外传感器装置（100; 200; 300），其包括半导体衬底（1），微机械地形成在半导体衬底（1）中的至少一个传感器元件（2），以及至少一个校准元件 ），所述传感器元件（2）在所述半导体衬底（1）中微机械地形成，其中吸收材料（6）在所述传感器元件（2）的区域中布置在所述半导体衬底（1）上，并且所述校准元件 其特征在于，所述传感器元件（2）和所述校准元件（3）各自形成在所述半导体基板（1）中的大体在所述传感器元件（2）下方并且基本位于所述校准元件（3）下方的洞穴（8） ）通过洞穴（8）与半导体衬底（1）的其余部分热和电隔离。 由此实现了红外传感器装置的高灵敏度，传感器元件的校准功能以及高信噪比。
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公开(公告)号：EP2212047A1
公开(公告)日：2010-08-04
申请号：EP08786290.0
申请日：2008-07-22
申请人： Robert Bosch GmbH
发明人： LOEWE, Andreas , HERRMANN, Ingo , MARX, Klaus , NIEHSEN, Wolfgang , KOEDER, Thilo , STELLMANN, Georg , PLATZER, Joachim , JACKISCH, Sebastian
CPC分类号： B23D59/001 , B23Q11/0082 , B23Q11/0092 , B23Q11/06 , B23Q17/24 , B23Q17/2438 , B27G19/02 , Y10T83/525 , Y10T83/7693 , Y10T83/7734
摘要： The invention relates to a machine tool, particularly a sawing machine, comprising a work surface (14) for placing a work piece (16) to be machined and a tool support unit (20) for supporting a tool (18), said unit being supported movably relative to the work surface (14). According to the invention, the machine tool comprises a tool operation monitoring device (60) for monitoring a tool region (68) at least during tool operation, said device comprising an imaging unit (62).
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公开(公告)号：EP1527352A1
公开(公告)日：2005-05-04
申请号：EP03787612.5
申请日：2003-06-27
申请人： Robert Bosch GmbH
发明人： SCHMOLLNGRUBER, Peter , HERRMANN, Ingo , SIEGLE, Henrik , KITTEL, Hartmut , FARBER, Paul , MAY, Ulrich
CPC分类号： B82Y25/00 , F01L1/00 , F01L2101/00 , F01L2820/041 , G01R33/093
摘要： Disclosed is a GMR sensor element comprising a rotationally symmetrical arrangement of eight GMR resistor elements in particular which are interconnected to form two Wheatston full bridges. Said GMR sensor element is particularly suitable for use in an angle sensor for detection of the absolute position of the camshaft or crankschaft in a motor vehicle, especially in a camshaft-free engine with electric or electrohydraulic valve control, a motor position of an electrically commutated motor or detection of a windscreen wiper position or in a steering angle sensor system in motor vehicles.
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