A method of manufacturing a batch of component carriers (600), wherein the method comprises providing a plurality of separate wafer structures (400), each comprising a plurality of electronic components (402), simultaneously laminating the wafer structures (400) with at least one electrically conductive layer structure (300, 404, 500) and at least one electrically insulating layer structure (300, 404, 500), and singularizing a structure resulting from the laminating into the plurality of component carriers (600), each comprising at least one of the electronic components (402), a part of the at least one electrically conductive layer structure (300, 404, 500) and a part of the at least one electrically insulating layer structure (300, 404, 500).