- 专利标题: METHOD FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE AND AN ARRANGEMENT FOR CARRYING OUT THE METHOD
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申请号: EP21203098.5申请日: 2014-09-25
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公开(公告)号: EP3957459A1公开(公告)日: 2022-02-23
- 发明人: HEIKKINEN, Mikko , SÄÄSKI, Jarmo , TORVINEN, Jarkko , NISKALA, Paavo , SIPPARI, Mikko , RAAPPANA, Pasi , KERÄNEN, Antti
- 申请人: TactoTek Oy
- 申请人地址: FI 90460 Oulunsalo Automaatiotie 1
- 代理机构: Berggren Oy
- 优先权: US201361883484 P 20130927
- 主分类号: B29C45/14
- IPC分类号: B29C45/14 ; H05K1/03 ; H05K1/16 ; H05K1/18 ; B29L31/34 ; H05K1/02 ; H05K3/00
摘要:
Method for manufacturing an electromechanical structure, comprising: producing (106) conductors and/or graphics on a substantially flat film, attaching (108) electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming (110) the said film housing the electronic elements into a substantially three-dimensional shape, using (112) the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement (500) for carrying out said method is also presented.
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