Invention Patent
- Patent Title: Lga package for the socket
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Application No.: JP2002379635Application Date: 2002-12-27
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Publication No.: JP2004207184APublication Date: 2004-07-22
- Inventor: SHIRAI HIROSHI , INOUE MASASHI , HASHIMOTO SHINICHI
- Applicant: Tyco Electronics Amp Kk , タイコエレクトロニクスアンプ株式会社
- Assignee: Tyco Electronics Amp Kk,タイコエレクトロニクスアンプ株式会社
- Current Assignee: Tyco Electronics Amp Kk,タイコエレクトロニクスアンプ株式会社
- Priority: JP2002379635 2002-12-27; JP2002317646 2002-10-31
- Main IPC: H01R33/76
- IPC: H01R33/76 ; H01L23/32 ; H01L23/40 ; H05K7/10
Abstract:
PROBLEM TO BE SOLVED: To provide an LGA package socket not causing deformation of a housing of the socket, having full strength even though being compact, being durable and simple and having good fixing workability. SOLUTION: A cover member 8 of the LGA package socket 1 has a bearing tongue piece 64 pivotally mounted around a shaft 26. A metallic reinforcing plate 10 is fixed on lower side of the housing 2 by four holding pieces 82. A lever 12 is journaled by journaling pieces 92, 96 of the reinforcing plate 10. When pressing an LGA package 200, the cover member 8 is locked by the shaft 26 and a lock part 15 of the lever 12. Then the housing 2 is held by the rigid metallic cover member 8 and the reinforcing plate 10. Thereby, possibility of deformation of the housing 2 is reduced. COPYRIGHT: (C)2004,JPO&NCIPI
Public/Granted literature
- JP3950795B2 Lga package for the socket Public/Granted day:2007-08-01
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