PROBLEM TO BE SOLVED: To provide a ball grid array type IC socket which sufficiently horizontally displaces a solder ball from a fixed part, of shortening a signal path, and of securing positional accuracy of the solder ball.
SOLUTION: Each contact 14 fixed to a contact receiving hole 12 of a housing 2 has a base part (fixed part) 44, a contact arm 46, and a tine 48 extending from the lower end of the base part 44 toward a board 8. The contact arm 46 is projected so as to be extended upward and bent in one direction. The tine 48 is composed of a solder ball connection part 62, and a transition part 66 for connecting the fixed part 44 to the connection part 62 and used for displacing it in the same direction as the contact arm 46. The transition part 66 has a vertical part 66b nearly vertical to the connection part 62 for preventing the displacement and deformation of the solder ball 63 by stopping the movement of the solder ball 64.
COPYRIGHT: (C)2005,JPO&NCIPI