Invention Patent
JP2006210448A Flex rigid wiring board and its manufacturing method
审中-公开
FLEX RIGID WIRING BOARD及其制造方法
- Patent Title: Flex rigid wiring board and its manufacturing method
- Patent Title (中): FLEX RIGID WIRING BOARD及其制造方法
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Application No.: JP2005017557Application Date: 2005-01-26
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Publication No.: JP2006210448APublication Date: 2006-08-10
- Inventor: TAKAHASHI KOICHI
- Applicant: Nec Corp , 日本電気株式会社
- Assignee: Nec Corp,日本電気株式会社
- Current Assignee: Nec Corp,日本電気株式会社
- Priority: JP2005017557 2005-01-26
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/40 ; H05K3/46
Abstract:
PROBLEM TO BE SOLVED: To obtain a flex rigid wiring board which can reduce a noise emitted from a side face end surface in a part connected with the flexible board of a rigid substrate. SOLUTION: In the flex rigid wiring board to which a plurality of the rigid substrates 1 are connected (coupled) by the flexible board 2, a structure of connecting the ground layer 3 of the flexible board 2 and the grand layer 6 of the rigid substrate 1 are connected by a copper plated layer 8 provided in the end surface of the rigid substrate 1. Consequently, the noise emitted from the side face end surface can be reduced in the part connected with the flexible board 2 of the rigid substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
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