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公开(公告)号：JP2005004332A
公开(公告)日：2005-01-06
申请号：JP2003164890
申请日：2003-06-10
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a musical material providing and selling system and method, and a musical material providing and selling program, that accurately check the status of use of musical materials by a user and accurately charge accordingly by counting the types and number of times of use of musical materials actually used by the user. SOLUTION: When a user 100 creates a musical piece on terminal equipment 110 of the user, times of use of musical materials 600 downloaded from a musical material providing and selling center 200 via a network 300 are counted by every type of musical material every time they are used not only for embedding in the musical piece but also for processing and copying in the musical piece. When the musical piece is saved, the terminal equipment sends use information 610 including the times of use to the musical material providing and selling center 200 via the network 300, and the musical material providing and selling center 200 creates charging information 241 according to the use information 610 and sends it to a charging center 400 via a network 500. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：提供音乐材料提供和销售系统和方法以及音乐材料提供和销售程序，其可以准确地检查用户使用音乐材料的状态并通过计数类型来相应地进行计费 和使用实际使用的音乐材料的次数。
解决方案：当用户100在用户的终端设备110上创建乐曲时，通过网络300从音乐材料提供和销售中心200下载的音乐材料600的使用时间由每种类型的音乐材料计数 每次它们不仅用于嵌入音乐作品，而且用于在乐曲中进行处理和复制。 当音乐作品被保存时，终端设备经由网络300向音乐材料提供和销售中心200发送包括使用时间的使用信息610，并且音乐材料提供和销售中心200根据使用创建计费信息241 信息610并通过网络500将其发送到计费中心400.版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2010212372A
公开(公告)日：2010-09-24
申请号：JP2009055400
申请日：2009-03-09
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a card edge terminal of a printed wiring board, the method which forms a connection terminal part in an edge portion of the board by electrolytic plating without forming a connecting lead wire serving as a feeding means for carrying out the electrolytic plating.
SOLUTION: This method of manufacturing card edge terminal of the printed wiring board incldues: the terminal forming step of using a copper thin film formed on the whole surface of the printed wiring board and carrying out the electrolytic gold plating in a predetermined area on the printed wiring board to form a terminal; and the circuit forming step of forming a wiring pattern of a circuit on the printed wiring board after the terminal forming step to perform structural processing.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供一种制造印刷电路板的卡边缘端子的方法，该方法通过电解电镀在基板的边缘部分中形成连接端子部分，而不形成用作 用于进行电镀的进料装置。 解决方案：印刷电路板的卡边缘端子的制造方法包括：在印刷电路板的整个表面上形成的铜薄膜的端子形成步骤，并在预定区域内进行电解镀金 在印刷电路板上形成一个终端; 以及在端子形成步骤之后在印刷线路板上形成电路的布线图案以进行结构处理的电路形成步骤。 版权所有（C）2010，JPO＆INPIT
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3.发明专利
公开(公告)号：JP2008198901A
公开(公告)日：2008-08-28
申请号：JP2007034489
申请日：2007-02-15
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board capable of constituting a large current circuit without damaging an etching property.
SOLUTION: The disclosed method includes the steps of: forming a pattern-like groove portion (c) which reaches a surface of an internal wiring pattern 23-2 and corresponds to the internal wiring pattern 23-2, in an insulating layer constituted of a resin layer 104 formed in the internal wiring pattern 23-2; and filling the groove portion (c) with metal materials 24. A thick internal wiring pattern 25 is constituted of the internal wiring pattern 23-2 and the metal materials 24.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种能够构成大电流电路而不损坏蚀刻性能的多层布线板的制造方法。 解决方案：所公开的方法包括以下步骤：在绝缘层中形成到达内部布线图案23-2的表面并对应于内部布线图案23-2的图案状的槽部分（c） 由形成在内部布线图案23-2中的树脂层104构成; 并且用金属材料24填充槽部（c）。厚内部布线图案25由内部布线图案23-2和金属材料24构成。版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2006210448A
公开(公告)日：2006-08-10
申请号：JP2005017557
申请日：2005-01-26
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To obtain a flex rigid wiring board which can reduce a noise emitted from a side face end surface in a part connected with the flexible board of a rigid substrate. SOLUTION: In the flex rigid wiring board to which a plurality of the rigid substrates 1 are connected (coupled) by the flexible board 2, a structure of connecting the ground layer 3 of the flexible board 2 and the grand layer 6 of the rigid substrate 1 are connected by a copper plated layer 8 provided in the end surface of the rigid substrate 1. Consequently, the noise emitted from the side face end surface can be reduced in the part connected with the flexible board 2 of the rigid substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：获得能够减少与刚性基板的柔性基板连接的部分中从侧面端面发出的噪声的柔性刚性布线板。 解决方案：在通过柔性板2连接（耦合）多个刚性基板1的柔性刚性布线板中，将柔性基板2的接地层3和连接到柔性基板2的隆起层6的结构 刚性基板1通过设置在刚性基板1的端面中的镀铜层8连接。因此，与刚性基板的柔性基板2连接的部分，能够减小从侧面端面发出的噪声 1.版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005183559A
公开(公告)日：2005-07-07
申请号：JP2003420289
申请日：2003-12-18
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board wherein heat from a heat producing element is efficiently diffused and radiated without causing a local overheat, and to provide a method for manufacturing the same.
SOLUTION: In the region for mounting a heat producing part 9 in a printed wiring board 100, a land 2 is provided with the size matching that of the heat producing part 9, a sufficiently large hole is formed at the middle of the land 2, a plating 3 is deposited as required on the wall of the hole, and the hole is filled with a heat conducting paste or the like for the formation of a heat conducting section 1. For heat radiation efficiency improvement, a heat radiating through hole 10 or a heat radiating via 11 is provided below the heat conducting section 1 as required, and opens to the surface of the printed wiring board 100 opposite to the surface whereon the heat producing parts 9.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种印刷电路板，其中来自发热元件的热量有效地扩散和辐射而不引起局部过热，并提供其制造方法。 解决方案：在用于将热产生部分9安装在印刷电路板100中的区域中，焊盘2具有与发热部分9的尺寸相匹配的尺寸，在中间产生足够大的孔 焊盘2，根据需要将电镀层3沉积在孔的壁上，并且填充有用于形成导热部分1的导热膏等的孔。为了散热效率提高，散热通过 孔10或散热通孔11根据需要设置在导热部1的下方，并且与印刷电路板100的与发热部9的表面相反的表面开口。（C）2005 ，JPO＆NCIPI
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Patent Agency Ranking
公开(公告)号：JP2005085776A
公开(公告)日：2005-03-31
申请号：JP2003312419
申请日：2003-09-04
Inventor： TAKAHASHI KOICHI
IPC: H05K3/46
Abstract: PROBLEM TO BE SOLVED: To detect a shift of the inner layers of a printed wiring board easily. SOLUTION: A surface layer solid pattern 3 and an inner layer solid pattern 6 are conducting through a large number of conduction vias 4. An inspection through hole 1 is provided within a range surrounded by the inner layer solid pattern 6 on the outside of the surface layer solid pattern 3. A circular insulation layer exposing part 5 concentric to the through hole 1 is provided in the inner layer solid pattern 6 and the diameter of the insulation layer exposing part 5 is set equal to the sum of the diameter of the inspection through hole 1 and the shift allowance A of the inner layer solid pattern 6. When the inner layer solid pattern 6 is shifted more than the allowance A from the surface layer solid pattern 3, the inner layer solid pattern 6 is connected with the through hole 1 and the decision is made that the inner layer is not shifted if the through hole 1 is conducting with the surface layer solid pattern 3, otherwise the decision is made that the inner layer is shifted. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract translation: 要解决的问题：容易地检测印刷电路板的内层的移动。 解决方案：表面层固体图案3和内层固体图案6通过大量的导电通孔4导电。检查通孔1设置在由外层固体图案6外围包围的范围内 的表层固体图案3.在内层固体图案6中设置有与通孔1同心的露出部分5的圆形绝缘层，并且将绝缘层暴露部分5的直径设定为等于 检查通孔1和内层固体图案6的移位余量A.当内层固体图案6从表层固体图案3移动超过余量A时，内层固体图案6与 通孔1，如果通孔1与表面层固体图案3导通，则判断为内层不移动，否则决定内层移动。 版权所有（C）2005，JPO＆NCIPI
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7.发明专利System and method for providing web service execution environment, and program 审中-公开提供WEB服务执行环境和程序的系统和方法
公开(公告)号：JP2007188432A
公开(公告)日：2007-07-26
申请号：JP2006007778
申请日：2006-01-16
Inventor： TAKAHASHI KOICHI
IPC: G06F12/00
Abstract: PROBLEM TO BE SOLVED: To prepare web service by preparing only a text file, to be disclosed by putting the file on a server.
SOLUTION: The web service 20 is mounted only with an XSLT 300, the web service 20 is arranged in a web service execution environment 500, by registration of the XSLT 300 with an XLM schemer 100 or the like, and a web server 400 executes a program for generating a WSDL 900 from the XLM schemer 100 or the like, and a fixed program for XSL-converting a message received by the web service 20 to be transmitted.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：通过仅准备文本文件来准备Web服务，通过将文件放在服务器上来进行披露。 解决方案：Web服务20仅安装有XSLT 300，web服务20被布置在web服务执行环境500中，通过XSLT 300与XLM schemer 100等的注册以及web服务器 400执行用于从XLM计算机100等产生WSDL 900的程序，以及固定程序，用于对由Web服务20接收的要发送的消息进行XSL转换。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2011108704A
公开(公告)日：2011-06-02
申请号：JP2009259522
申请日：2009-11-13
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To manufacture a printed wiring board including large current wiring and signal wiring by simple manufacturing steps. SOLUTION: The method of manufacture a printed wiring board includes a step for etching a part of a conductor layer covering at least one surface of an insulating substrate 11 to form a pattern from which the conductor layer is removed, a step for forming a groove pattern 33 by removing the part of the insulating substrate 11 in the pattern from which the conductor layer is removed, a step for forming large current wiring 21 by inserting a conductor pattern having a shape suitable to the groove pattern 33 into the groove pattern 33, a step for fixing the large current wiring 21 and the groove pattern 33 with adhesive 22, and a step for forming signal wiring 13 by patterning the residual part of the conductor layer. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：通过简单的制造步骤制造包括大电流布线和信号布线的印刷布线板。 解决方案：制造印刷线路板的方法包括用于蚀刻覆盖绝缘基板11的至少一个表面的导体层的一部分以形成除去导体层的图案的步骤，用于形成 通过去除除去导体层的图案中的绝缘基板11的一部分的凹槽图案33，通过将具有适合于凹槽图案33的形状的导体图案插入凹槽图案中来形成大电流布线21的步骤 如图33所示，用粘合剂22固定大电流布线21和槽图案33的步骤，以及通过对导体层的剩余部分进行构图来形成信号布线13的步骤。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2009200234A
公开(公告)日：2009-09-03
申请号：JP2008040040
申请日：2008-02-21
Inventor： TAKAHASHI KOICHI
CPC classification number: H01L2924/0002 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To solve the problem that it is troublesome to assemble a metal base substrate since a printed wiring board is fitted to a metal plate often by soldering and screwing after components are mounted. SOLUTION: The present invention relates to the metal base substrate having the metal plate and printed wiring board, the metal base substrate having the metal plate has at least one fixing pin for fixing the positions of a solder layer formed between the printed wiring board and metal plate and the printed wiring board, and the printed wiring board which has an insertion hole which is formed corresponding to the position of the fixing pin and in which the fixing pin is pressed. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了解决组装金属基底板是麻烦的问题，因为印刷线路板经常通过在安装部件之后通过焊接和旋拧而被装配到金属板上。 解决方案：本发明涉及具有金属板和印刷线路板的金属基底板，具有金属板的金属基底具有至少一个固定销，用于固定形成在印刷线路之间的焊料层的位置 板和金属板和印刷线路板，以及印刷电路板，其具有与固定销的位置对应地形成的插入孔，并且固定销被按压。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2007194328A
公开(公告)日：2007-08-02
申请号：JP2006009707
申请日：2006-01-18
Inventor： TAKAHASHI KOICHI
Abstract: PROBLEM TO BE SOLVED: To provide a printed-wiring board low inhibiting an effective heat capacity in the case of the soldered joint of a through-hole for inserting a lead wire for a mounting part. SOLUTION: The through-hole 15 for inserting the lead wire for the mounting part is formed to the printed-wiring board 10. Conductive layers 17 with striped openings 18 are formed to the wall surface of the through-hole 15. The effective heat capacity of the through-hole 15 in the case of a soldering is inhibited at a small value by reducing the connecting areas of the conductive layers 17 and solid wiring layers 14, thus improving a solderability. COPYRIGHT: (C)2007,JPO&INPIT
Abstract translation: 要解决的问题：提供一种在用于插入用于安装部件的引线的通孔的焊接接头的情况下，抑制有效热容的印刷电路板。 ＆lt; P＆gt;解决方案：用于插入用于安装部分的引线的通孔15形成到印刷电路板10.具有条纹开口18的导电层17形成在通孔15的壁表面上。 通过减少导电层17和固体配线层14的连接面积，在焊接的情况下通孔15的有效热容被抑制在较小的值，从而提高可焊性。 版权所有（C）2007，JPO＆INPIT
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