Invention Patent
- Patent Title: Laminated film and process for producing semiconductor device
- Patent Title (中): 层压膜和制造半导体器件的方法
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Application No.: JP2010101713Application Date: 2010-04-27
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Publication No.: JP2010278427APublication Date: 2010-12-09
- Inventor: OTAKE HIRONAO , KAMIYA KATSUHIKO
- Applicant: Nitto Denko Corp , 日東電工株式会社
- Assignee: Nitto Denko Corp,日東電工株式会社
- Current Assignee: Nitto Denko Corp,日東電工株式会社
- Priority: JP2009110575 2009-04-30
- Main IPC: H01L21/52
- IPC: H01L21/52 ; C09J7/02 ; C09J11/00 ; C09J11/06 ; C09J133/04 ; C09J201/00 ; H01L21/301
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated film which is superior in dicing property, picking-up property, fouling preventive property and storage stability. SOLUTION: A laminated film 1 has a constitution that a die-adhering layer 3 is laminated on an adhesive layer 2b of an adhesive sheet 2; the adhesive layer of the adhesive sheet is formed of an adhesive composition containing a base polymer and a thermal crosslinking agent, and the adhesive layer is such that a gel fraction, before heating is less than 90 wt.% and the gel fraction after heating, is changed by 90 wt.% or more. As the thermal crosslinking agent, there is suitably used a thermal crosslinking agent where crosslinking-reactive functional groups are inactivated prior to heating; and at least two crosslinking-reactive functional groups in one molecule are capable of being activated by heating. As the thermal crosslinking agent, a blocked isocyanate is preferred. COPYRIGHT: (C)2011,JPO&INPIT
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