Invention Patent
JP2010278427A Laminated film and process for producing semiconductor device 审中-公开
层压膜和制造半导体器件的方法

Laminated film and process for producing semiconductor device
Abstract:
PROBLEM TO BE SOLVED: To provide a laminated film which is superior in dicing property, picking-up property, fouling preventive property and storage stability. SOLUTION: A laminated film 1 has a constitution that a die-adhering layer 3 is laminated on an adhesive layer 2b of an adhesive sheet 2; the adhesive layer of the adhesive sheet is formed of an adhesive composition containing a base polymer and a thermal crosslinking agent, and the adhesive layer is such that a gel fraction, before heating is less than 90 wt.% and the gel fraction after heating, is changed by 90 wt.% or more. As the thermal crosslinking agent, there is suitably used a thermal crosslinking agent where crosslinking-reactive functional groups are inactivated prior to heating; and at least two crosslinking-reactive functional groups in one molecule are capable of being activated by heating. As the thermal crosslinking agent, a blocked isocyanate is preferred. COPYRIGHT: (C)2011,JPO&INPIT
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