PROBLEM TO BE SOLVED: To provide an adhesive film useful for connecting semiconductor chips, forming no space even when heated and press-adhered at a small pressure, capable of connecting a semiconductor chip to a member for outside connection or semiconductors to each other, and having excellent press adhesivity and excellent workability in the press-adhesion process, to provide a connection member which is used for semiconductors, uses the adhesive film and has high reliability, and to provide a semiconductor device. SOLUTION: This adhesive film can heat and press-adhere a semiconductor chip to a wiring member for loading the semiconductor chip and for outside connection, or the semiconductor chip to an another semiconductor chip at a press-adhesion pressure of 0.01 to 0.5 MPa. The adhesive film can preferably heat and press-adhere the semiconductor chip and the like in conditions satisfying formula 1: 1×10 (1) [F is press-adhesion pressure; (t) is a press adhesion time; and (η) is a melt viscosity at a press adhesive temperature]. The adhesive film preferably has a melt viscosity of >=1×10 Pa.s at a temperature of Pa.s at a press-adhesion temperature.