Invention Patent
- Patent Title: A method for manufacturing a semiconductor device
-
Application No.: JP2011114335Application Date: 2011-05-23
-
Publication No.: JP5393726B2Publication Date: 2014-01-22
- Inventor: 充弘 一條 , 勇臣 浅見 , 規悦 鈴木 , 英人 大沼 , 雅人 米澤
- Applicant: 株式会社半導体エネルギー研究所
- Assignee: 株式会社半導体エネルギー研究所
- Current Assignee: 株式会社半導体エネルギー研究所
- Priority: JP2001167330 2001-06-01; JP2001209354 2001-07-10; JP2001295484 2001-09-27
- Main IPC: H01L21/205
- IPC: H01L21/205 ; C23C16/02 ; C23C16/24 ; C30B1/02 ; H01L21/20 ; H01L21/322 ; H01L21/336 ; H01L29/786
Abstract:
A semiconductor film having a crystalline structure is formed by using a metal element that assists the crystallization of the semiconductor film, and the metal element remaining in the film is effectively removed to decrease the dispersion among the elements. The semiconductor film or, typically, an amorphous silicon film having an amorphous structure is obtained based on the plasma CVD method as a step of forming a gettering site, by using a monosilane, a rare gas element and hydrogen as starting gases, the film containing the rare gas element at a high concentration or, concretely, at a concentration of 1x1020/cm3 to 1x1021/cm3 and containing fluorine at a concentration of 1x1015/cm3 to 1x1017/cm3.
Public/Granted literature
- JP2011211214A Method of forming semiconductor film Public/Granted day:2011-10-20
Information query
IPC分类: