一种半导体设备及其制法，该半导体设备包括：基板，系具有基板本体与形成于该基板本体上之至少一金属垫，该金属垫具有第一表面与形成于该第一表面之至少一开孔；半导体组件，系具有至少一焊垫；导电组件，系形成于该金属垫与该焊垫之间及该金属垫之开孔内；以及胶体，系形成于该基板与该半导体组件之间，以包覆该导电组件。借此，本发明能强化该导电组件与该金属垫间之接合力，以提升该半导体设备之良率。

Disclosed is a semiconductor device and its method of manufacture, the semiconductor device comprising a substrate having a main body and at least a metal pad formed on the main body, the metal pad having a first surface and one or more opening formed on the first opening; a semiconductor element having at least a solder pad; a conductive element formed between the metal pad and the solder pad and in the opening of the metal pad; and an encapsulant formed between the substrate and the semiconductor element to enclose the conductive element, thereby strengthening the bonding between the conductive element and the metal pad and thus enhancing good yield of the semiconductor device.