一种半导体封装件之制法，系先借由复数支撑组件叠放第二基板于第一基板上，且该第二基板具有至少一贯通之清理孔，再进行清理该支撑组件之作业，并利用该清理孔清理该第二基板与该第一基板之间的空间。本发明复提供该半导体封装件、基板及封装结构。

A manufacturing method of a semiconductor package is comprising: stacking a second substrate on a first substrate by plurality support element, wherein the second substrate has at least a through cleaning via, and performing a operation of cleaning the support element and cleaning the space between the second substrate and the first substrate by using of the cleaning via. The invention further provides the semiconductor package, a substrate, and a packaged structure.