一种集成电路封装系统及其制法包括：基板，其系具有在基板顶面、基板底面及数个垂直面之间的内部电路；集成电路，其系耦合至该内部电路；模造封装体，其系直接形成于该集成电路及该基板之基板顶面上；以及导电保形屏蔽结构，其系直接铺设至该模造封装体、该等垂直面上且在耦合至该内部电路之该基板底面下面延伸。

An integrated circuit packaging system and method of manufacture thereof includes: a substrate with internal circuitry between a substrate top side, a substrate bottom side, and vertical sides; an integrated circuit coupled to the internal circuitry; a molded package body formed directly on the integrated circuit and the substrate top side of the substrate; and a conductive conformal shield structure applied directly on the molded package body, the vertical sides, and to extend below the substrate bottom side coupled to the internal circuitry.