一种电子封装件，系于承载件上设置复数电子元与一挡架，令该挡架位于相邻两电子组件之间，且以封装层包覆该些电子组件并使该挡架之部分表面凸出该封装层，又于该封装层上形成电性连接该挡架之屏蔽组件，借以提升电磁屏蔽之功效。本发明复提供该电子封装件之制法。

An electronic package is provided, including a carrier, a plurality of electronic elements disposed on the carrier, a stop frame disposed on the carrier and between two adjacent one of the electronic elements, an encapsulating layer encapsulating the electronic elements, with a portion of a surface of the stop frame exposed from the encapsulating layer, and a shielding element disposed on the encapsulating layer and electrically connected to the stop frame. The shielding element enhances the EMI shielding effect for the electronic package. A method for fabricating the electronic package is also provided.