Invention Grant
- Patent Title: Tensile strained semiconductor photon emission and detection devices and integrated photonics system
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Application No.: US15000975Application Date: 2016-04-04
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Publication No.: US10008827B2Publication Date: 2018-06-26
- Inventor: Paul A. Clifton , Andreas Goebel , R. Stockton Gaines
- Applicant: Acorn Technologies, Inc.
- Applicant Address: US CA La Jolla
- Assignee: Acorn Technologies, Inc.
- Current Assignee: Acorn Technologies, Inc.
- Current Assignee Address: US CA La Jolla
- Agency: Ascenda Law Group, PC
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/187 ; H01L31/0352 ; H01S5/22 ; H01S5/32 ; H01L33/34 ; B82Y20/00 ; H01L31/028 ; H01L31/18 ; H01S5/125 ; H01S5/34 ; H01L27/146 ; H01S5/227

Abstract:
Tensile strained germanium is provided that can be sufficiently strained to provide a nearly direct band gap material or a direct band gap material. Compressively stressed or tensile stressed stressor materials in contact with germanium regions induce uniaxial or biaxial tensile strain in the germanium regions. Stressor materials may include silicon nitride or silicon germanium. The resulting strained germanium structure can be used to emit or detect photons including, for example, generating photons within a resonant cavity to provide a laser.
Public/Granted literature
- US20160211649A1 TENSILE STRAINED SEMICONDUCTOR PHOTON EMISSION AND DETECTION DEVICES AND INTEGRATED PHOTONICS SYSTEM Public/Granted day:2016-07-21
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