Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US15827070Application Date: 2017-11-30
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Publication No.: US10026873B2Publication Date: 2018-07-17
- Inventor: Toru Hashimoto
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2016-049506 20160314
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/48 ; H01L33/50 ; H01L33/60 ; H01L33/62 ; H01L33/54
Abstract:
A method of manufacturing a light emitting device includes: mounting at least one light emitting element on a support member with a first surface of the light emitting element facing upward; applying an adhesive to the first surface of the light emitting element by holding the support member and dipping the first surface of the light emitting element in the adhesive; and disposing a light-transmissive member on the first surface of the light emitting element via the adhesive.
Public/Granted literature
- US20180083167A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-03-22
Information query
IPC分类:
