- 专利标题： Electronic devices with yielding substrates
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申请号： US15495014申请日： 2017-04-24
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公开(公告)号： US10037947B1公开(公告)日： 2018-07-31
- 发明人: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- 申请人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- 申请人地址： CA Richmond, British Columbia
- 专利权人： COOLEDGE LIGHTING INC.
- 当前专利权人： COOLEDGE LIGHTING INC.
- 当前专利权人地址： CA Richmond, British Columbia
- 代理机构： Morgan, Lewis & Bockius LLP
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/00 ; H01L23/538 ; H01L33/50 ; H01L23/14
摘要：
In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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