Invention Grant
- Patent Title: Thin film semiconductor device
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Application No.: US15223632Application Date: 2016-07-29
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Publication No.: US10043864B2Publication Date: 2018-08-07
- Inventor: Minoru Oda , Shinji Mori , Kiwamu Sakuma , Masumi Saitoh
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustdat, L.L.P.
- Priority: JP2015-152626 20150731
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/04 ; H01L29/786 ; H01L29/66 ; H01L29/78

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor layer, a second semiconductor layer, a third semiconductor layer, and a first electrode. The third semiconductor layer is provided between the first semiconductor layer and the second semiconductor layer. The first electrode opposes the third semiconductor layer. An orientation ratio of the third semiconductor layer is higher than an orientation ratio of the first semiconductor layer.
Public/Granted literature
- US20170033175A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-02-02
Information query
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