Invention Grant
- Patent Title: Slurry composition for chemical mechanical polishing, method of preparing the same, and polishing method using the same
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Application No.: US15293816Application Date: 2016-10-14
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Publication No.: US10047248B2Publication Date: 2018-08-14
- Inventor: Ye-hwan Kim , Un-gyu Paik , Ji-hoon Seo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do KR Seoul
- Assignee: Samsung Electronics Co., Ltd.,Industry-University Cooperation Foundation Hanyang University
- Current Assignee: Samsung Electronics Co., Ltd.,Industry-University Cooperation Foundation Hanyang University
- Current Assignee Address: KR Gyeonggi-do KR Seoul
- Agency: Harness, Dickey, & Pierce, P.L.C.
- Priority: KR10-2015-0144315 20151015
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04
Abstract:
A slurry composition for the CMP process includes a dispersion medium, and ceria particles having a NO3 functional group bonded to surfaces thereof. The ceria particles are contained in an amount of about 0.1 parts by weight to about 15 parts by weight based on 100 parts by weight of the dispersion medium.
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