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公开(公告)号：US10047248B2
公开(公告)日：2018-08-14
申请号：US15293816
申请日：2016-10-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ye-hwan Kim , Un-gyu Paik , Ji-hoon Seo
Abstract: A slurry composition for the CMP process includes a dispersion medium, and ceria particles having a NO3 functional group bonded to surfaces thereof. The ceria particles are contained in an amount of about 0.1 parts by weight to about 15 parts by weight based on 100 parts by weight of the dispersion medium.
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