An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate.