Invention Grant
- Patent Title: Bonding method and bonded structure
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Application No.: US15238789Application Date: 2016-08-17
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Publication No.: US10052713B2Publication Date: 2018-08-21
- Inventor: Shigeru Sato , Ryoichi Ishii , Takahiro Ito , Mayumi Kouya
- Applicant: ULTEX CORPORATION
- Applicant Address: JP Fukuoka-shi
- Assignee: ULTEX CORPORATION
- Current Assignee: ULTEX CORPORATION
- Current Assignee Address: JP Fukuoka-shi
- Agency: Sughrue Mion, PLLC
- Agent Richard C. Turner
- Priority: JP2015-163236 20150820
- Main IPC: B23K1/06
- IPC: B23K1/06 ; B23K20/10 ; B23K20/00 ; B23K20/227 ; B23K103/16 ; B23K103/18 ; B23K103/00 ; B23K101/42

Abstract:
A bonding target member 1 having a solid bonding material 3 with aluminum as a main component is interposed between a metal member 2 and a ceramic member 4 and an elastic member 12 are pressurized by a pressurizing section 13 and a bonding tool section 15 of a resonator 14 in a vertical direction. The bonding tool section 15 of the resonator 14 resonates with sound vibration or ultrasound vibration transmitted from an oscillator 16. An interfacial portion between the metal member 2 and the bonding material 3 with aluminum as a main component and an interfacial portion between the bonding material 3 with aluminum as a main component and the ceramic member 4 each receive pressurization and vibration energy to be bonded together. The metal member 2 and the ceramic member 4 can be bonded together at ordinary temperature in the atmosphere with the bonding material 3 with aluminum as a main component. When the ceramic member 4 has a thickness resistant to pressurization and vibration energy at the time of bonding to resist crack, the elastic member 12 may be disposed on a metal member 2 side, or may not be used.
Public/Granted literature
- US20170050262A1 BONDING METHOD AND BONDED STRUCTURE Public/Granted day:2017-02-23
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