Invention Grant
- Patent Title: Methods of bonding using evaporation operative materials having low environmental impact
-
Application No.: US15288398Application Date: 2016-10-07
-
Publication No.: US10059849B2Publication Date: 2018-08-28
- Inventor: Ryan Hulse , Diana Mercier , Kane Cook , Rajat S. Basu , Martin R. Paonessa
- Applicant: HONEYWELL INTERNATIONAL INC.
- Applicant Address: US NJ Morris Plains
- Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee: HONEYWELL INTERNATIONAL INC.
- Current Assignee Address: US NJ Morris Plains
- Agent Colleen D. Szuch
- Main IPC: C09D7/00
- IPC: C09D7/00 ; C10M171/00 ; A01N25/02 ; A01N25/04 ; A61K47/06 ; B05D1/02 ; B05D1/18 ; A61K31/727 ; B05D1/28 ; B05D1/30 ; B05D3/00 ; C08J3/09 ; C09D133/00 ; C09J5/00 ; C09J11/06 ; C09J183/04 ; C10M131/04 ; C09D7/20
Abstract:
A method of bonding two surfaces by delivering to at least one of the surfaces an adhesive composition comprising: (a) at least one active bonding component; and (b) a carrier in an amount effective to at least partially solvate or at least partially emulsify said active bonding component, said carrier comprising monochlorotrifluoropropene, and then forming a bond between the surfaces.
Public/Granted literature
- US20170022374A1 EVAPORATION OPERATIVE MATERIALS HAVING LOW ENVIRONMENTAL IMPACT Public/Granted day:2017-01-26
Information query
IPC分类:
